P

Inventor

LUNSMAN HARVEY J

US28 patents
⚠️ This page may combine multiple inventors who share the name “LUNSMAN HARVEY J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HEWLETT PACKARD ENTPR DEV LP

27 patents
US10667431B1May 26, 2020

Memory module cooling

HEWLETT PACKARD ENTPR DEV LP18 citations85
US11157050B1Oct 26, 2021

Compute node tray cooling

HEWLETT PACKARD ENTPR DEV LP16 citations84
US10827649B2Nov 3, 2020

Cooling fluids in opposite directions across a device

HEWLETT PACKARD ENTPR DEV LP12 citations84
US10881030B1Dec 29, 2020

Electrical and liquid cooling midplane

HEWLETT PACKARD ENTPR DEV LP14 citations81
US10806056B2Oct 13, 2020

Cooling system for high-performance computer

HEWLETT PACKARD ENTPR DEV LP7 citations76
US11800682B2Oct 24, 2023

Cooling module and a method of assembling the cooling module to an electronic circuit module

HEWLETT PACKARD ENTPR DEV LP4 citations75
US11974414B2Apr 30, 2024

Conforming heat transport device for dual inline memory module cooling applications

HEWLETT PACKARD ENTPR DEV LP3 citations74
US12105538B2Oct 1, 2024

Pressure regulator assembly for a coolant distribution unit

HEWLETT PACKARD ENTPR DEV LP2 citations73
US10750639B2Aug 18, 2020

Cooling memory modules

HEWLETT PACKARD ENTPR DEV LP4 citations73
US11579668B2Feb 14, 2023

Multipoint contact conduction cooling of a removable device

HEWLETT PACKARD ENTPR DEV LP2 citations68
US12547193B2Feb 10, 2026

Pressure regulator assembly for a coolant distribution unit

HEWLETT PACKARD ENTPR DEV LP0 citations62
US12432884B2Sep 30, 2025

Conforming heat transport device for dual inline memory module cooling applications

HEWLETT PACKARD ENTPR DEV LP0 citations62
US12408303B2Sep 2, 2025

Elastomer embedded multipoint contact cooling

HEWLETT PACKARD ENTPR DEV LP0 citations62
US12336138B2Jun 17, 2025

Variable flow liquid-cooled cooling module

HEWLETT PACKARD ENTPR DEV LP0 citations62
US11497137B2Nov 8, 2022

Method and apparatus for extended serial temperature control in a compute device

HEWLETT PACKARD ENTPR DEV LP0 citations62
US12309969B2May 20, 2025

Receptacle with connectable spring finger for multipoint contact conduction cooling

HEWLETT PACKARD ENTPR DEV LP0 citations60
US11729943B2Aug 15, 2023

Receptacle with connectable spring finger for multipoint contact conduction cooling

HEWLETT PACKARD ENTPR DEV LP0 citations60
US11662126B2May 30, 2023

Leak mitigation system

HEWLETT PACKARD ENTPR DEV LP0 citations60
US11284527B2Mar 22, 2022

Latch assembly for a modular device

HEWLETT PACKARD ENTPR DEV LP0 citations55
US12313089B2May 27, 2025

Cool fluid reservoir for a coolant distribution unit

HEWLETT PACKARD ENTPR DEV LP0 citations52
US12200902B2Jan 14, 2025

Cooling module and a method of cooling an electronic circuit module using the cooling module

HEWLETT PACKARD ENTPR DEV LP0 citations52
US11803216B2Oct 31, 2023

Contiguous plane infrastructure for computing systems

HEWLETT PACKARD ENTPR DEV LP0 citations52
US11152283B2Oct 19, 2021

Rack and row-scale cooling

HEWLETT PACKARD ENTPR DEV LP0 citations52
US10941892B2Mar 9, 2021

Valved connector

HEWLETT PACKARD ENTPR DEV LP0 citations52
US12439564B2Oct 7, 2025

Lever actuated cold plate

HEWLETT PACKARD ENTPR DEV LP0 citations51
US11417451B2Aug 16, 2022

Magnetic blocks for thermally coupling cooling component and heat spreader

HEWLETT PACKARD ENTPR DEV LP0 citations51
US11406036B2Aug 2, 2022

Flexible I/O server interface card orientation

HEWLETT PACKARD ENTPR DEV LP0 citations46

SILICON GRAPHICS INT CORP

1 patent