Inventor
LUNSMAN HARVEY J
US28 patents
⚠️ This page may combine multiple inventors who share the name “LUNSMAN HARVEY J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HEWLETT PACKARD ENTPR DEV LP
27 patentsUS10667431B1May 26, 2020
Memory module cooling
HEWLETT PACKARD ENTPR DEV LP18 citations85
US11157050B1Oct 26, 2021
Compute node tray cooling
HEWLETT PACKARD ENTPR DEV LP16 citations84
US10827649B2Nov 3, 2020
Cooling fluids in opposite directions across a device
HEWLETT PACKARD ENTPR DEV LP12 citations84
US10881030B1Dec 29, 2020
Electrical and liquid cooling midplane
HEWLETT PACKARD ENTPR DEV LP14 citations81
US10806056B2Oct 13, 2020
Cooling system for high-performance computer
HEWLETT PACKARD ENTPR DEV LP7 citations76
US11800682B2Oct 24, 2023
Cooling module and a method of assembling the cooling module to an electronic circuit module
HEWLETT PACKARD ENTPR DEV LP4 citations75
US11974414B2Apr 30, 2024
Conforming heat transport device for dual inline memory module cooling applications
HEWLETT PACKARD ENTPR DEV LP3 citations74
US12105538B2Oct 1, 2024
Pressure regulator assembly for a coolant distribution unit
HEWLETT PACKARD ENTPR DEV LP2 citations73
US10750639B2Aug 18, 2020
Cooling memory modules
HEWLETT PACKARD ENTPR DEV LP4 citations73
US11579668B2Feb 14, 2023
Multipoint contact conduction cooling of a removable device
HEWLETT PACKARD ENTPR DEV LP2 citations68
US12547193B2Feb 10, 2026
Pressure regulator assembly for a coolant distribution unit
HEWLETT PACKARD ENTPR DEV LP0 citations62
US12432884B2Sep 30, 2025
Conforming heat transport device for dual inline memory module cooling applications
HEWLETT PACKARD ENTPR DEV LP0 citations62
US12408303B2Sep 2, 2025
Elastomer embedded multipoint contact cooling
HEWLETT PACKARD ENTPR DEV LP0 citations62
US12336138B2Jun 17, 2025
Variable flow liquid-cooled cooling module
HEWLETT PACKARD ENTPR DEV LP0 citations62
US11497137B2Nov 8, 2022
Method and apparatus for extended serial temperature control in a compute device
HEWLETT PACKARD ENTPR DEV LP0 citations62
US12309969B2May 20, 2025
Receptacle with connectable spring finger for multipoint contact conduction cooling
HEWLETT PACKARD ENTPR DEV LP0 citations60
US11729943B2Aug 15, 2023
Receptacle with connectable spring finger for multipoint contact conduction cooling
HEWLETT PACKARD ENTPR DEV LP0 citations60
US11662126B2May 30, 2023
Leak mitigation system
HEWLETT PACKARD ENTPR DEV LP0 citations60
US11284527B2Mar 22, 2022
Latch assembly for a modular device
HEWLETT PACKARD ENTPR DEV LP0 citations55
US12313089B2May 27, 2025
Cool fluid reservoir for a coolant distribution unit
HEWLETT PACKARD ENTPR DEV LP0 citations52
US12200902B2Jan 14, 2025
Cooling module and a method of cooling an electronic circuit module using the cooling module
HEWLETT PACKARD ENTPR DEV LP0 citations52
US11803216B2Oct 31, 2023
Contiguous plane infrastructure for computing systems
HEWLETT PACKARD ENTPR DEV LP0 citations52
US11152283B2Oct 19, 2021
Rack and row-scale cooling
HEWLETT PACKARD ENTPR DEV LP0 citations52
US10941892B2Mar 9, 2021
Valved connector
HEWLETT PACKARD ENTPR DEV LP0 citations52
US12439564B2Oct 7, 2025
Lever actuated cold plate
HEWLETT PACKARD ENTPR DEV LP0 citations51
US11417451B2Aug 16, 2022
Magnetic blocks for thermally coupling cooling component and heat spreader
HEWLETT PACKARD ENTPR DEV LP0 citations51
US11406036B2Aug 2, 2022
Flexible I/O server interface card orientation
HEWLETT PACKARD ENTPR DEV LP0 citations46