Inventor

LU JIECH-FUN

TW88 patents

⚠️ This page may combine multiple inventors who share the name “LU JIECH-FUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LU JIECH-FUN

TAIWAN SEMICONDUCTOR MFG CO LTD

Method of forming absorption enhancement structure for image sensor

Integrated magnetic core inductor and methods of fabrications thereof

Charge release layer to remove charge carriers from dielectric grid structures in image sensors

Method for forming a semiconductor-on-insulator (SOI) substrate

Method for forming a thin semiconductor-on-insulator (SOI) substrate

Absorption enhancement structure for image sensor

Method for fabricating magnetic core

BSI image sensor and method of forming same

Bond pad structure with reduced step height and increased electrical isolation

Back-side deep trench isolation structure for image sensor

Method for forming thin semiconductor-on-insulator (SOI) substrates

Through-substrate via formation to enlarge electrochemical plating window

Absorption enhancement structure to increase quantum efficiency of image sensor

Method for forming a semiconductor-on-insulator (SOI) substrate

Dummy vertical transistor structure to reduce cross talk in pixel sensor

Bond pad structure with reduced step height and increased electrical isolation

Self aligned grids in BSI image sensor

Concave reflector for complementary metal oxide semiconductor image sensor (CIS)

Absorption enhancement structure for image sensor

Concave reflector for complementary metal oxide semiconductor image sensor (CIS)

Method for forming thin semiconductor-on-insulator (SOI) substrates

Absorption enhancement structure for image sensor

Front side illuminated image sensor device structure and method for forming the same

Photodiode gate dielectric protection layer

Semiconductor structure and manufacturing method thereof

Varied STI liners for isolation structures in image sensing devices

Image sensor device structure

Photodiode gate dielectric protection layer

BSI image sensor and method of forming same

BSI image sensor and method of forming same

Semiconductor structure and manufacturing method thereof

Magnetic memory with metal oxide etch stop layer and method for manufacturing the same

Through-substrate via formation to enlarge electrochemical plating window

Method for forming a semiconductor-on-insulator (SOI) substrate

Method for forming a semiconductor-on-insulator (SOI) substrate

Method for forming thin semiconductor-on-insulator (SOI) substrates

Uniform trenches in semiconductor devices and manufacturing method thereof

Absorption enhancement structure to increase quantum efficiency of image sensor

Method for forming light pipe structure with high quantum efficiency

Self aligned grids in BSI image sensor

Ring structure for film resistor

Absorption enhancement structure to increase quantum efficiency of image sensor

Charge release layer to remove charge carriers from dielectric grid structures in image sensors

Concave reflector for complementary metal oxide semiconductor image sensor (CIS)

BSI image sensor and method of forming same

TAIWAN SEMICONDUCTOR MFG

Varied STI liners for isolation structures in image sensing devices

3DIC interconnect apparatus and method

System and method for preventing etch arcing during semiconductor processing

TING SHYH-FANN

Multiple metal film stack in BSI chips

LU JIECH-FUN

Method for forming MTJ cells