Inventor
HSU PO-YEN
TW36 patents
⚠️ This page may combine multiple inventors who share the name “HSU PO-YEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
WINBOND ELECTRONICS CORP
33 patentsUS10636842B1Apr 28, 2020
Resistive random access memory and method for forming the same
WINBOND ELECTRONICS CORP13 citations84
US11800815B2Oct 24, 2023
Resistive random access memory cell and method of fabricating the same
WINBOND ELECTRONICS CORP2 citations72
US11793095B2Oct 17, 2023
Resistive random access memory and method of fabricating the same
WINBOND ELECTRONICS CORP6 citations72
US11329222B2May 10, 2022
Resistive random access memory and manufacturing method thereof
WINBOND ELECTRONICS CORP3 citations72
US11239417B1Feb 1, 2022
Resistive random access memory and method of manufacturing the same
WINBOND ELECTRONICS CORP4 citations72
US10593877B2Mar 17, 2020
Resistive random access memory
WINBOND ELECTRONICS CORP2 citations72
US10522755B2Dec 31, 2019
Resistive memory and method of fabricating the same
WINBOND ELECTRONICS CORP5 citations72
US9972779B2May 15, 2018
Resistive random access memory
WINBOND ELECTRONICS CORP3 citations72
US11770985B2Sep 26, 2023
Resistive random access memory and method of fabricating the same
WINBOND ELECTRONICS CORP2 citations71
US11552245B2Jan 10, 2023
Conductive bridge random access memory and method of manufacturing the same
WINBOND ELECTRONICS CORP2 citations71
US10340450B2Jul 2, 2019
Resistive random access memory structure and forming method thereof
WINBOND ELECTRONICS CORP4 citations71
US11917837B2Feb 27, 2024
Method of forming the semiconductor device
WINBOND ELECTRONICS CORP2 citations70
US11177321B2Nov 16, 2021
Resistive random access memories and method for fabricating the same
WINBOND ELECTRONICS CORP2 citations69
US11823738B2Nov 21, 2023
Resistive memory apparatus
WINBOND ELECTRONICS CORP0 citations62
US11758832B2Sep 12, 2023
Method of manufacturing resistive random access memory
WINBOND ELECTRONICS CORP0 citations62
US11258011B2Feb 22, 2022
Resistive random access memory structure and manufacturing method thereof
WINBOND ELECTRONICS CORP0 citations62
US11189660B2Nov 30, 2021
Non-volatile memory and method of fabricating the same
WINBOND ELECTRONICS CORP1 citations62
US11024802B2Jun 1, 2021
Method of fabricating resistive memory
WINBOND ELECTRONICS CORP0 citations62
US10950789B2Mar 16, 2021
Resisitive random access memory structure and method for forming the same
WINBOND ELECTRONICS CORP0 citations62
US12114579B2Oct 8, 2024
Method of fabricating resistive random access memory cell
WINBOND ELECTRONICS CORP0 citations61
US12029049B2Jul 2, 2024
Memory structures and methods for forming the same
WINBOND ELECTRONICS CORP0 citations61
US11785868B2Oct 10, 2023
Semiconductor structure and method of forming the same
WINBOND ELECTRONICS CORP0 citations61
US11424407B2Aug 23, 2022
Resistive random access memory and method of manufacturing the same
WINBOND ELECTRONICS CORP0 citations61
US11495637B2Nov 8, 2022
Resistive random access memory and method of manufacturing the same
WINBOND ELECTRONICS CORP0 citations60
US11011702B2May 18, 2021
Memory devices and methods for forming the same
WINBOND ELECTRONICS CORP0 citations60
US11476305B2Oct 18, 2022
Semiconductor device and method of forming the same
WINBOND ELECTRONICS CORP0 citations59
US12550681B2Feb 10, 2026
Standby current detection circuit
WINBOND ELECTRONICS CORP0 citations51
US11793094B2Oct 17, 2023
Resistive memory
WINBOND ELECTRONICS CORP0 citations51
US9960349B2May 1, 2018
Resistive random-access memory structure and method for fabricating the same
WINBOND ELECTRONICS CORP1 citations51
US9356235B2May 31, 2016
Structure and formation method of memory device
WINBOND ELECTRONICS CORP0 citations51
US9166160B1Oct 20, 2015
Resistive random access memory and method of fabricating the same
WINBOND ELECTRONICS CORP0 citations51
US11152566B2Oct 19, 2021
Resistive random access memory
WINBOND ELECTRONICS CORP0 citations50
US11637241B2Apr 25, 2023
Resistive random access memory and manufacturing method thereoff
WINBOND ELECTRONICS CORP0 citations46