Inventor
ANDRICACOS PANAYOTIS C
US20 patents
Patents
20 patentsUS7008871B2Mar 7, 2006
Selective capping of copper wiring
IBM105 citations98
US6344129B1Feb 5, 2002
Method for plating copper conductors and devices formed
IBM46 citations96
US5522975AJun 4, 1996
Electroplating workpiece fixture
IBM144 citations96
US5516412AMay 14, 1996
Vertical paddle plating cell
IBM394 citations96
US5352350AOct 4, 1994
Method for controlling chemical species concentration
IBM75 citations96
US5132859AJul 21, 1992
Thin film structures for magnetic recording heads
IBM58 citations96
US6471845B1Oct 29, 2002
Method of controlling chemical bath composition in a manufacturing environment
IBM63 citations95
US7190079B2Mar 13, 2007
Selective capping of copper wiring
IBM39 citations92
US6911229B2Jun 28, 2005
Structure comprising an interlayer of palladium and/or platinum and method for fabrication thereof
IBM20 citations92
US6251251B1Jun 26, 2001
Anode design for semiconductor deposition
IBM35 citations92
US5582927ADec 10, 1996
High magnetic moment materials and process for fabrication of thin film heads
IBM33 citations91
US5385661AJan 31, 1995
Acid electrolyte solution and process for the electrodeposition of copper-rich alloys exploiting the phenomenon of underpotential deposition
IBM43 citations90
US7638406B2Dec 29, 2009
Method of fabricating a high Q factor integrated circuit inductor
IBM13 citations84
US7068138B2Jun 27, 2006
High Q factor integrated circuit inductor
IBM12 citations84
US6331237B1Dec 18, 2001
Method of improving contact reliability for electroplating
IBM12 citations70
US7829427B2Nov 9, 2010
Method of fabricating a high Q factor integrated circuit inductor
IBM4 citations63
US6992389B2Jan 31, 2006
Barrier for interconnect and method
IBM4 citations61
US6979393B2Dec 27, 2005
Method for plating copper conductors and devices formed
IBM0 citations52
US6776885B2Aug 17, 2004
Integrated plating and planarization apparatus having a variable-diameter counterelectrode
IBM0 citations52
US7227265B2Jun 5, 2007
Electroplated copper interconnection structure, process for making and electroplating bath
IBM1 citations51