Inventor
IWADACHI TAKAHARU
JP12 patents
Patents
12 patentsUS4792365ADec 20, 1988
Production of beryllium-copper alloys and alloys produced thereby
NGK INSULATORS LTD32 citations91
US6164524ADec 26, 2000
HIP-bonded body and method of producing the same
NGK INSULATORS LTD17 citations83
US6286750B1Sep 11, 2001
Method of manufacturing beryllium-copper alloy hot isostatic press (HIP) bonded body and hip-bonded body
NGK INSULATORS LTD14 citations72
US6176418B1Jan 23, 2001
Composite bonding material of beryllium, copper alloy and stainless steel and composite bonding method
NGK INSULATORS LTD13 citations72
US4935202AJun 19, 1990
Electrically conductive spring materials
NGK INSULATORS LTD6 citations72
US4696704ASep 29, 1987
Material for lead frames
NGK INSULATORS LTD10 citations71
US4692192ASep 8, 1987
Electroconductive spring material
NGK INSULATORS LTD17 citations67
US5354388AOct 11, 1994
Production of beryllium-copper alloys and beryllium copper alloys produced thereby
NGK INSULATORS LTD7 citations65
US5074922ADec 24, 1991
Method of producing beryllium copper alloy member
NGK INSULATORS LTD8 citations65
US5131958AJul 21, 1992
Method of hot forming beryllium-copper alloy and hot formed product thereof
NGK INSULATORS LTD6 citations60
US6824888B2Nov 30, 2004
Bonded body comprising beryllium member and copper or copper alloy member, and method of manufacturing the same
NGK INSULATORS LTD4 citations59
US6777720B2Aug 17, 2004
Semiconductor light-emitting element having first and second epitaxial layer group II-VI semiconductor compounds on a substrate
NGK INSULATORS LTD0 citations50