Inventor
OTA KAZUNOBU
JP35 patents
⚠️ This page may combine multiple inventors who share the name “OTA KAZUNOBU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SONY CORP
9 patentsUS9923010B2Mar 20, 2018
Solid-state imaging device, manufacturing method of solid-state imaging device, and electronic device
SONY CORP10 citations92
US9595557B2Mar 14, 2017
Solid-state imaging device, manufacturing method of solid-state imaging device, and electronic device
SONY CORP10 citations92
US10504953B2Dec 10, 2019
Solid-state imaging device, manufacturing method of solid-state imaging device, and electronic device
SONY CORP7 citations84
US10418404B2Sep 17, 2019
Solid-state imaging device, manufacturing method of solid-state imaging device, and electronic device
SONY CORP4 citations84
US10128291B2Nov 13, 2018
Solid-state imaging device, manufacturing method of solid-state imaging device, and electronic device
SONY CORP8 citations84
US9673235B2Jun 6, 2017
Solid-state imaging device, manufacturing method of solid-state imaging device, and electronic device
SONY CORP6 citations84
US11791368B2Oct 17, 2023
Image pickup element, image pickup apparatus, and method of manufacturing image pickup element
SONY CORP2 citations73
US10825858B2Nov 3, 2020
Image pickup element, image pickup apparatus, and method of manufacturing image pickup element
SONY CORP1 citations62
US10306166B2May 28, 2019
Solid-state imaging device, manufacturing method thereof, camera, and electronic device
SONY CORP0 citations52
RENESAS ELECTRONICS CORP
7 patentsUS8541272B2Sep 24, 2013
Method of manufacturing semiconductor device with offset sidewall structure
RENESAS ELECTRONICS CORP1 citations63
US9349816B2May 24, 2016
Method of manufacturing semiconductor device with offset sidewall structure
RENESAS ELECTRONICS CORP0 citations52
US9214464B2Dec 15, 2015
Method of manufacturing semiconductor device with offset sidewall structure
RENESAS ELECTRONICS CORP0 citations52
US8987081B2Mar 24, 2015
Method of manufacturing semiconductor device with offset sidewall structure
RENESAS ELECTRONICS CORP0 citations52
US8859360B2Oct 14, 2014
Method of manufacturing semiconductor device with offset sidewall structure
RENESAS ELECTRONICS CORP0 citations52
US8642418B2Feb 4, 2014
Method of manufacturing semiconductor device with offset sidewall structure
RENESAS ELECTRONICS CORP0 citations52
US7998802B2Aug 16, 2011
Method of manufacturing semiconductor device with offset sidewall structure
RENESAS ELECTRONICS CORP0 citations52
RENESAS TECH CORP
6 patentsUS7563663B2Jul 21, 2009
Method of manufacturing semiconductor device with offset sidewall structure
RENESAS TECH CORP9 citations93
US7531402B2May 12, 2009
Method of manufacturing semiconductor device with offset sidewall structure
RENESAS TECH CORP18 citations93
US7220637B2May 22, 2007
Method of manufacturing semiconductor device with offset sidewall structure
RENESAS TECH CORP20 citations93
US7109553B2Sep 19, 2006
Semiconductor device and method of manufacturing same
RENESAS TECH CORP14 citations84
US6806537B2Oct 19, 2004
Semiconductor device having offset insulation film formed on insulation film, and method of manufacturing the same
RENESAS TECH CORP13 citations84
US7170109B2Jan 30, 2007
Heterojunction semiconductor device with element isolation structure
RENESAS TECH CORP7 citations74
SONY SEMICONDUCTOR SOLUTIONS CORP
5 patentsUS9661194B2May 23, 2017
Solid-state imaging device, manufacturing method thereof, camera, and electronic device
SONY SEMICONDUCTOR SOLUTIONS CORP6 citations84
US9887219B2Feb 6, 2018
Solid-state imaging device, manufacturing method of solid-state imaging device, and electronic device
SONY SEMICONDUCTOR SOLUTIONS CORP5 citations83
US10192912B2Jan 29, 2019
Solid-state imaging device, manufacturing method of solid-state imaging device, and electronic device
SONY SEMICONDUCTOR SOLUTIONS CORP2 citations72
US10332921B2Jun 25, 2019
Solid-state image sensing device and method for manufacturing the same, and electronic device
SONY SEMICONDUCTOR SOLUTIONS CORP2 citations71
US12543389B2Feb 3, 2026
Light-receiving element, X-ray imaging element, and electronic apparatus
SONY SEMICONDUCTOR SOLUTIONS CORP0 citations48
MITSUBISHI ELECTRIC CORP
4 patentsUS6436777B1Aug 20, 2002
Semiconductor device and manufacturing method thereof
MITSUBISHI ELECTRIC CORP56 citations96
US6521963B1Feb 18, 2003
Semiconductor device and method of manufacturing semiconductor device
MITSUBISHI ELECTRIC CORP37 citations92
US6248653B1Jun 19, 2001
Method of manufacturing gate structure
MITSUBISHI ELECTRIC CORP11 citations73
US6521517B1Feb 18, 2003
Method of fabricating a gate electrode using a second conductive layer as a mask in the formation of an insulating layer by oxidation of a first conductive layer
MITSUBISHI ELECTRIC CORP3 citations62