Inventor
MASUDA AKIHIRO
JP47 patents
⚠️ This page may combine multiple inventors who share the name “MASUDA AKIHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TDK CORP
22 patentsUS11222752B2Jan 11, 2022
Ceramic electronic device
TDK CORP3 citations73
US11158460B2Oct 26, 2021
Ceramic electronic component with lead terminals having a coating layer
TDK CORP2 citations73
US11810723B2Nov 7, 2023
Ceramic electronic component
TDK CORP0 citations63
US12062495B2Aug 13, 2024
Electronic device
TDK CORP0 citations62
US11961676B2Apr 16, 2024
Electronic device
TDK CORP0 citations62
US11798743B2Oct 24, 2023
Electronic device
TDK CORP0 citations62
US11615920B2Mar 28, 2023
Ceramic electronic device
TDK CORP1 citations62
US11140781B2Oct 5, 2021
Electronic device
TDK CORP0 citations62
US12432860B2Sep 30, 2025
Electronic device
TDK CORP0 citations56
US12340943B2Jun 24, 2025
Electronic device
TDK CORP0 citations52
US11594379B2Feb 28, 2023
Electronic device
TDK CORP0 citations52
US12476048B2Nov 18, 2025
Electronic component including accommodation part having opening
TDK CORP0 citations51
US12412702B2Sep 9, 2025
Electronic device having ceramic element and metal terminals
TDK CORP0 citations51
US11646163B2May 9, 2023
Electronic device
TDK CORP0 citations51
US11495405B2Nov 8, 2022
Electronic device
TDK CORP0 citations51
US11367572B2Jun 21, 2022
Conductive terminal and electronic device
TDK CORP0 citations51
US11335508B2May 17, 2022
Electronic device
TDK CORP0 citations51
US12548711B2Feb 10, 2026
Electronic device
TDK CORP0 citations50
US12437927B2Oct 7, 2025
Electronic device with a ceramic element and surface-mount terminals
TDK CORP0 citations50
US12417880B2Sep 16, 2025
Electronic device having first and second metal terminals
TDK CORP0 citations50
US12278055B2Apr 15, 2025
Electronic component
TDK CORP0 citations50
US11984260B2May 14, 2024
Electronic device including chip component and case
TDK CORP0 citations49
GENESIS TECHNOLOGY INC
7 patentsUS7015710B2Mar 21, 2006
Contact probe and probe device
GENESIS TECHNOLOGY INC118 citations98
US6903563B2Jun 7, 2005
Contact probe and probe device
GENESIS TECHNOLOGY INC112 citations98
US6900647B2May 31, 2005
Contact probe and probe device
GENESIS TECHNOLOGY INC121 citations98
US6937042B2Aug 30, 2005
Contact probe and probe device
GENESIS TECHNOLOGY INC63 citations95
US6919732B2Jul 19, 2005
Contact probe and probe device
GENESIS TECHNOLOGY INC62 citations95
US6917211B2Jul 12, 2005
Contact probe and probe device
GENESIS TECHNOLOGY INC61 citations95
US6710608B2Mar 23, 2004
Contact probe and probe device
GENESIS TECHNOLOGY INC20 citations92
MITSUBISHI GAS CHEMICAL CO
3 patentsUS9199778B2Dec 1, 2015
Oxygen absorbing resin composition, oxygen absorbing multilayered body, and oxygen absorbing hollow container
MITSUBISHI GAS CHEMICAL CO4 citations70
US10081480B2Sep 25, 2018
Container
MITSUBISHI GAS CHEMICAL CO0 citations37
US9334377B2May 10, 2016
Process for producing resin composition containing active particles
MITSUBISHI GAS CHEMICAL CO0 citations37
IMANISHI RYO
2 patentsMITSUBISHI MATERIALS CORP
2 patentsUS5651873AJul 29, 1997
Electroplating solution for forming Pb-Sn alloy bump electrodes on semiconductor wafer surface
MITSUBISHI MATERIALS CORP14 citations72
US9506163B2Nov 29, 2016
Method of electroplating with Sn-alloy and apparatus of electroplating with Sn-alloy
MITSUBISHI MATERIALS CORP0 citations44
KATASE TAKUMA
2 patentsUS9067800B2Jun 30, 2015
Method for manufacturing tin(II) oxide powder for replenishing tin component of tin-alloy plating solution, and tin (II) oxide powder manufactured using said method
KATASE TAKUMA4 citations66
US9108861B2Aug 18, 2015
Tin(II) oxide powder for replenishing tin component of tin-alloy plating solution and method for manufacturing said powder
KATASE TAKUMA1 citations45