Inventor
NGAI CHRISTOPHER S
US27 patents
⚠️ This page may combine multiple inventors who share the name “NGAI CHRISTOPHER S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
25 patentsUS6355571B1Mar 12, 2002
Method and apparatus for reducing copper oxidation and contamination in a semiconductor device
APPLIED MATERIALS INC98 citations99
US6573030B1Jun 3, 2003
Method for depositing an amorphous carbon layer
APPLIED MATERIALS INC1,317 citations98
US6841341B2Jan 11, 2005
Method of depositing an amorphous carbon layer
APPLIED MATERIALS INC78 citations97
US7223526B2May 29, 2007
Method of depositing an amorphous carbon layer
APPLIED MATERIALS INC50 citations96
US6656840B2Dec 2, 2003
Method for forming silicon containing layers on a substrate
APPLIED MATERIALS INC54 citations93
US7335462B2Feb 26, 2008
Method of depositing an amorphous carbon layer
APPLIED MATERIALS INC24 citations92
US6946401B2Sep 20, 2005
Plasma treatment for copper oxide reduction
APPLIED MATERIALS INC28 citations92
US9502262B2Nov 22, 2016
Nanocrystalline diamond carbon film for 3D NAND hardmask application
APPLIED MATERIALS INC5 citations84
US6700202B2Mar 2, 2004
Semiconductor device having reduced oxidation interface
APPLIED MATERIALS INC8 citations74
US11437284B2Sep 6, 2022
Contact over active gate structure
APPLIED MATERIALS INC2 citations73
US10930555B2Feb 23, 2021
Contact over active gate structure
APPLIED MATERIALS INC2 citations73
US9865464B2Jan 9, 2018
Nanocrystalline diamond carbon film for 3D NAND hardmask application
APPLIED MATERIALS INC2 citations73
US9815091B2Nov 14, 2017
Roll to roll wafer backside particle and contamination removal
APPLIED MATERIALS INC2 citations73
US9728406B2Aug 8, 2017
Multi materials and selective removal enabled reverse tone process
APPLIED MATERIALS INC4 citations73
US11429026B2Aug 30, 2022
Lithography process window enhancement for photoresist patterning
APPLIED MATERIALS INC2 citations72
US7105442B2Sep 12, 2006
Ashable layers for reducing critical dimensions of integrated circuit features
APPLIED MATERIALS INC9 citations71
US12201030B2Jan 14, 2025
Spin-orbit torque MRAM structure and manufacture thereof
APPLIED MATERIALS INC0 citations62
US12198985B2Jan 14, 2025
Contact over active gate structure
APPLIED MATERIALS INC0 citations62
US11723283B2Aug 8, 2023
Spin-orbit torque MRAM structure and manufacture thereof
APPLIED MATERIALS INC0 citations62
US10957590B2Mar 23, 2021
Method for forming a layer
APPLIED MATERIALS INC0 citations62
US10930556B2Feb 23, 2021
Contact over active gate structure
APPLIED MATERIALS INC1 citations62
US9337051B2May 10, 2016
Method for critical dimension reduction using conformal carbon films
APPLIED MATERIALS INC2 citations62
US11914299B2Feb 27, 2024
Lithography process window enhancement for photoresist patterning
APPLIED MATERIALS INC0 citations61
US11650506B2May 16, 2023
Film structure for electric field guided photoresist patterning process
APPLIED MATERIALS INC0 citations61
US11880137B2Jan 23, 2024
Film structure for electric field guided photoresist patterning process
APPLIED MATERIALS INC0 citations60