Inventor

CHANG JE-YOUNG

US46 patents

⚠️ This page may combine multiple inventors who share the name “CHANG JE-YOUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHANG JE-YOUNG

INTEL CORP

Computer assembly providing cooling for more than one electronic component

Microelectronic package and method of cooling same

Use of adjusted evaporator section area of heat pipe that is sized to match the surface area of an integrated heat spreader used in CPU packages in mobile computers

Enhanced flow channel for component cooling in computer systems

Integrated circuit coolant microchannel assembly with targeted channel configuration

Apparatus for using fluid laden with nanoparticles for application in electronic cooling

Methods of direct cooling of packaged devices and structures formed thereby

Enhanced flow channel for component cooling in computer systems

Integrated circuit coolant microchannel with compliant cover

Hybrid interposer of glass and silicon to reduce thermal crosstalk

Integrated circuit coolant microchannel assembly with manifold member that facilitates coolant line attachment

Integrated circuit coolant microchannel assembly with manifold member that facilitates coolant line attachment

Immersion cooling for integrated circuit devices

Thermal management component

IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnects

Integrated circuit assemblies having metal foam structures

Heat dissipation lid having direct liquid contact conduits

Thermoelectric coolers combined with phase-change material in integrated circuit packages

Coupled cooling fins in ultra-small systems

Thermal assemblies for multi-chip packages

Heat management system

Method and apparatus for protecting thermal interfaces

Cooling solution including microchannel arrays and methods of forming the same

Package wrap-around heat spreader

Direct liquid micro jet (DLMJ) structures for addressing thermal performance at limited flow rate conditions

Two-phase metallic alloys to facilitate thermal energy storage of a system on chip

Radiation shield around a component on a substrate

IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnects

IC die and heat spreaders with solderable thermal interface structures for assemblies including solder array thermal interconnects

Full package vapor chamber with IHS

Die back side structures for warpage control

Coolant capable of enhancing corrosion inhibition, system containing same, and method of manufacturing same

3D buildup of thermally conductive layers to resolve die height differences

Multi-surface heat sink suitable for multi-chip packages

Heat dissipation device having shielding/containment extensions

Integrated heat spreader with enhanced vapor chamber for multichip packages

IC die with solderable thermal interface structures for assemblies including solder array thermal interconnects

Modular technique for die-level liquid cooling

Standoff members for semiconductor package

Apparatus for inspection of a package assembly with a thermal solution

Embedded substrate heat sink for bottom side cooling

Phase change materials for electromagnetic interference shielding and heat dissipation in integrated circuit assemblies

CHANG JE-YOUNG

Enabling an aluminum heat exchanger with a working fluid

Biosensor for analyzing quantitatively analyte with a predetermined size and larger than, and manufacturing method thereof

CHOUDHURY ARNAB

Thermal management solution for circuit products

ALL MEDICUS CO LTD

Biosensor for analyzing quantitatively analyte with a predetermined size and larger than, and manufacturing method thereof