Inventor
LEE YONG-GILL
TW4 patents
Patents
4 patentsUS7087462B1Aug 8, 2006
Method for forming leadless semiconductor packages
ADVANCED SEMICONDUCTOR ENG81 citations95
US7125747B2Oct 24, 2006
Process for manufacturing leadless semiconductor packages including an electrical test in a matrix of a leadless leadframe
ADVANCED SEMICONDUCTOR ENG50 citations91
US6984878B2Jan 10, 2006
Leadless leadframe with an improved die pad for mold locking
ADVANCED SEMICONDUCTOR ENG22 citations90
US7211467B2May 1, 2007
Method for fabricating leadless packages with mold locking characteristics
ADVANCED SEMICONDUCTOR ENG7 citations71