Inventor
SHEK MEIYEE
US6 patents
⚠️ This page may combine multiple inventors who share the name “SHEK MEIYEE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
5 patentsUS7229911B2Jun 12, 2007
Adhesion improvement for low k dielectrics to conductive materials
APPLIED MATERIALS INC24 citations92
US7371427B2May 13, 2008
Reduction of hillocks prior to dielectric barrier deposition in Cu damascene
APPLIED MATERIALS INC11 citations84
US7718548B2May 18, 2010
Selective copper-silicon-nitride layer formation for an improved dielectric film/copper line interface
APPLIED MATERIALS INC11 citations81
US7723228B2May 25, 2010
Reduction of hillocks prior to dielectric barrier deposition in Cu damascene
APPLIED MATERIALS INC6 citations73
US7601651B2Oct 13, 2009
Method to improve the step coverage and pattern loading for dielectric films
APPLIED MATERIALS INC4 citations62