Inventor
LIM HOON
KR33 patents
⚠️ This page may combine multiple inventors who share the name “LIM HOON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
24 patentsUS7719033B2May 18, 2010
Semiconductor devices having thin film transistors and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD20 citations92
US6399451B1Jun 4, 2002
Semiconductor device having gate spacer containing conductive layer and manufacturing method therefor
SAMSUNG ELECTRONICS CO LTD48 citations92
US7982221B2Jul 19, 2011
Semiconductor memory device having three dimensional structure
SAMSUNG ELECTRONICS CO LTD15 citations91
US7825472B2Nov 2, 2010
Semiconductor device having a plurality of stacked transistors and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD21 citations91
US7315466B2Jan 1, 2008
Semiconductor memory device and method for arranging and manufacturing the same
SAMSUNG ELECTRONICS CO LTD27 citations91
US7417286B2Aug 26, 2008
Semiconductor integrated circuit devices having single crystalline thin film transistors and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD9 citations84
US6448149B1Sep 10, 2002
Method for making shallow trench isolation in semiconductor fabrication
SAMSUNG ELECTRONICS CO LTD14 citations79
US7432560B2Oct 7, 2008
Body-tied-to-source MOSFETs with asymmetrical source and drain regions and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD8 citations74
US7589992B2Sep 15, 2009
Semiconductor device having three dimensional structure
SAMSUNG ELECTRONICS CO LTD7 citations72
US10269958B2Apr 23, 2019
Semiconductor device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD4 citations67
US9978865B2May 22, 2018
Semiconductor device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD2 citations67
US7473590B2Jan 6, 2009
Semiconductor device having body contact through gate and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD2 citations63
US7247528B2Jul 24, 2007
Methods of fabricating semiconductor integrated circuits using selective epitaxial growth and partial planarization techniques
SAMSUNG ELECTRONICS CO LTD4 citations63
US7193276B2Mar 20, 2007
Semiconductor devices with a source/drain regions formed on a recessed portion of an isolation layer
SAMSUNG ELECTRONICS CO LTD5 citations63
US7141851B2Nov 28, 2006
Transistors having a recessed channel region
SAMSUNG ELECTRONICS CO LTD3 citations63
US7994582B2Aug 9, 2011
Stacked load-less static random access memory device
SAMSUNG ELECTRONICS CO LTD6 citations62
US7978561B2Jul 12, 2011
Semiconductor memory devices having vertically-stacked transistors therein
SAMSUNG ELECTRONICS CO LTD3 citations62
US7592625B2Sep 22, 2009
Semiconductor transistor with multi-level transistor structure and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD3 citations62
US7312110B2Dec 25, 2007
Methods of fabricating semiconductor devices having thin film transistors
SAMSUNG ELECTRONICS CO LTD6 citations62
US7405450B2Jul 29, 2008
Semiconductor devices having high conductivity gate electrodes with conductive line patterns thereon
SAMSUNG ELECTRONICS CO LTD3 citations61
US9281377B2Mar 8, 2016
Semiconductor device having silicide on gate sidewalls in isolation regions
SAMSUNG ELECTRONICS CO LTD0 citations52
US8916941B2Dec 23, 2014
Semiconductor device having silicide on gate sidewalls in isolation regions
SAMSUNG ELECTRONICS CO LTD1 citations52
US7485535B2Feb 3, 2009
Methods of fabricating semiconductor devices with a source/drain formed on a recessed portion of an isolation layer
SAMSUNG ELECTRONICS CO LTD0 citations52
US7927932B2Apr 19, 2011
Semiconductor device having a plurality of stacked transistors and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD1 citations50