Inventor
DIAO JIE
US11 patents
⚠️ This page may combine multiple inventors who share the name “DIAO JIE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
6 patentsUS10350728B2Jul 16, 2019
System and process for in situ byproduct removal and platen cooling during CMP
APPLIED MATERIALS INC9 citations81
US10322492B2Jun 18, 2019
Retaining ring for CMP
APPLIED MATERIALS INC3 citations72
US11673226B2Jun 13, 2023
Retaining ring for CMP
APPLIED MATERIALS INC0 citations62
US7422982B2Sep 9, 2008
Method and apparatus for electroprocessing a substrate with edge profile control
APPLIED MATERIALS INC2 citations62
US7344432B2Mar 18, 2008
Conductive pad with ion exchange membrane for electrochemical mechanical polishing
APPLIED MATERIALS INC3 citations60
US7504018B2Mar 17, 2009
Electrochemical method for Ecmp polishing pad conditioning
APPLIED MATERIALS INC1 citations51
DIAO JIE
4 patentsUS9800831B2Oct 24, 2017
Conveying attention information in virtual conference
DIAO JIE9 citations81
US9538133B2Jan 3, 2017
Conveying gaze information in virtual conference
DIAO JIE2 citations70
US9369667B2Jun 14, 2016
Conveying gaze information in virtual conference
DIAO JIE3 citations70
US8211325B2Jul 3, 2012
Process sequence to achieve global planarity using a combination of fixed abrasive and high selectivity slurry for pre-metal dielectric CMP applications
DIAO JIE1 citations49