Inventor
AGA HIROJI
JP45 patents
⚠️ This page may combine multiple inventors who share the name “AGA HIROJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHINETSU HANDOTAI KK
36 patentsUS6372609B1Apr 16, 2002
Method of Fabricating SOI wafer by hydrogen ION delamination method and SOI wafer fabricated by the method
SHINETSU HANDOTAI KK512 citations99
US6140210AOct 31, 2000
Method of fabricating an SOI wafer and SOI wafer fabricated thereby
SHINETSU HANDOTAI KK111 citations98
US6362076B1Mar 26, 2002
Method of fabricating an SOI wafer by hydrogen ion delamination without independent bonding heat treatment
SHINETSU HANDOTAI KK54 citations96
US6284628B1Sep 4, 2001
Method of recycling a delaminated wafer and a silicon wafer used for the recycling
SHINETSU HANDOTAI KK100 citations94
US6380551B2Apr 30, 2002
Optical function device with photonic band gap and/or filtering characteristics
SHINETSU HANDOTAI KK49 citations93
US6238990B1May 29, 2001
Method for heat treatment of SOI wafer and SOI wafer heat-treated by the method
SHINETSU HANDOTAI KK19 citations93
US6846718B1Jan 25, 2005
Method for producing SOI wafer and SOI wafer
SHINETSU HANDOTAI KK42 citations92
US6239004B1May 29, 2001
Method of forming oxide film on an SOI layer and method of fabricating a bonded wafer
SHINETSU HANDOTAI KK30 citations92
US6884696B2Apr 26, 2005
Method for producing bonding wafer
SHINETSU HANDOTAI KK36 citations91
US7320929B2Jan 22, 2008
Method of fabricating SOI wafer
SHINETSU HANDOTAI KK14 citations84
US6998329B2Feb 14, 2006
SOI wafer producing method, and wafer separating jig
SHINETSU HANDOTAI KK15 citations84
US5998281ADec 7, 1999
SOI wafer and method for the preparation thereof
SHINETSU HANDOTAI KK14 citations74
US9793154B2Oct 17, 2017
Method for manufacturing bonded SOI wafer
SHINETSU HANDOTAI KK2 citations73
US7176102B2Feb 13, 2007
Method for producing SOI wafer and SOI wafer
SHINETSU HANDOTAI KK8 citations70
US7560313B2Jul 14, 2009
SOI wafer and method for producing the same
SHINETSU HANDOTAI KK4 citations63
US6897124B2May 24, 2005
Method of manufacturing a bonded wafers using a Bernoulli chuck
SHINETSU HANDOTAI KK5 citations63
US7902042B2Mar 8, 2011
Method of manufacturing SOI wafer and thus-manufactured SOI wafer
SHINETSU HANDOTAI KK2 citations62
US11244851B2Feb 8, 2022
Method for manufacturing SOI wafer
SHINETSU HANDOTAI KK0 citations52
US9076840B2Jul 7, 2015
Method for manufacturing a bonded SOI wafer
SHINETSU HANDOTAI KK1 citations52
US7959731B2Jun 14, 2011
Method for producing semiconductor wafer
SHINETSU HANDOTAI KK0 citations52
US7524744B2Apr 28, 2009
Method of producing SOI wafer and SOI wafer
SHINETSU HANDOTAI KK1 citations52
US10115580B2Oct 30, 2018
Method for manufacturing an SOI wafer
SHINETSU HANDOTAI KK0 citations51
US9378999B2Jun 28, 2016
Method for manufacturing SOI wafer
SHINETSU HANDOTAI KK0 citations51
US9337080B2May 10, 2016
Method for manufacturing SOI wafer
SHINETSU HANDOTAI KK1 citations51
US7521334B2Apr 21, 2009
Method for producing direct bonded wafer and direct bonded wafer
SHINETSU HANDOTAI KK0 citations49
US10490440B2Nov 26, 2019
Method for manufacturing bonded SOI wafer
SHINETSU HANDOTAI KK0 citations42
US10204824B2Feb 12, 2019
Method for producing SOI wafer
SHINETSU HANDOTAI KK0 citations42
US9953860B2Apr 24, 2018
Method of manufacturing SOI wafer
SHINETSU HANDOTAI KK0 citations42
US9865497B2Jan 9, 2018
Method for manufacturing bonded wafer
SHINETSU HANDOTAI KK0 citations42
US9859149B2Jan 2, 2018
Method of producing bonded wafer with uniform thickness distribution
SHINETSU HANDOTAI KK0 citations42
US9773694B2Sep 26, 2017
Method for manufacturing bonded wafer
SHINETSU HANDOTAI KK0 citations42
US9679800B2Jun 13, 2017
Method for manufacturing bonded wafer
SHINETSU HANDOTAI KK0 citations42
US9240344B2Jan 19, 2016
Method for manufacturing SOI wafer
SHINETSU HANDOTAI KK0 citations42
US9673085B2Jun 6, 2017
Method for manufacturing SOI wafer
SHINETSU HANDOTAI KK0 citations41
US9093497B2Jul 28, 2015
Method for manufacturing bonded SOI wafer
SHINETSU HANDOTAI KK0 citations41
US9029240B2May 12, 2015
Method for manufacturing SOI wafer
SHINETSU HANDOTAI KK0 citations41
SOITEC SILICON ON INSULATOR
2 patentsUS7288418B2Oct 30, 2007
Process for treating substrates for the microelectronics industry, and substrates obtained by this process
SOITEC SILICON ON INSULATOR20 citations91
US7029993B1Apr 18, 2006
Method for treating substrates for microelectronics and substrates obtained according to said method
SOITEC SILICON ON INSULATOR31 citations91