Inventor

UEDA RYUJI

JP10 patents

⚠️ This page may combine multiple inventors who share the name “UEDA RYUJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DSM IP ASSETS BV

4 patents

US10672928B2Jun 2, 2020

Metal foil pattern layered body, metal foil layered body, metal foil multi-layer substrate, solar cell module, and method of manufacturing metal foil pattern layered body

DSM IP ASSETS BV2 citations71

US9478674B2Oct 25, 2016

Method of manufacturing a circuit board by punching

DSM IP ASSETS BV4 citations70

US10056517B2Aug 21, 2018

Metal foil pattern layered body, metal foil layered body, metal foil multi-layer substrate, solar cell module, and method of manufacturing metal foil pattern layered body

DSM IP ASSETS BV0 citations50

US10651320B2May 12, 2020

Method of manufacturing a circuit board by punching

DSM IP ASSETS BV0 citations49

TAKATA GO

2 patents

US8878445B2Nov 4, 2014

Light-emitting element driving device

TAKATA GO9 citations82

US8159140B2Apr 17, 2012

Load driving apparatus

TAKATA GO4 citations60

PANASONIC CORP

1 patent

US9237627B2Jan 12, 2016

Light-emitting element driving device

PANASONIC CORP4 citations71

TOPPAN PRINTING CO LTD

1 patent

US7498074B2Mar 3, 2009

Metal photoetching product and production method thereof

TOPPAN PRINTING CO LTD5 citations60

MITSUBISHI ELECTRIC CORP

1 patent

US5403989AApr 4, 1995

Method and apparatus for removing foreign matters from a cathode-ray tube

MITSUBISHI ELECTRIC CORP3 citations56

UEDA RYUJI

1 patent

US8110344B2Feb 7, 2012

Metal photoetching product and production method thereof

UEDA RYUJI1 citations43