Inventor
JINDO ASUMI
JP14 patents
⚠️ This page may combine multiple inventors who share the name “JINDO ASUMI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NGK INSULATORS LTD
12 patentsUS9142439B2Sep 22, 2015
Laminated structure, member for semiconductor manufacturing apparatus, and method for producing laminated structure
NGK INSULATORS LTD13 citations84
US8679998B2Mar 25, 2014
Corrosion-resistant member for semiconductor manufacturing apparatus and method for manufacturing the same
NGK INSULATORS LTD11 citations84
US9245775B2Jan 26, 2016
Heating device
NGK INSULATORS LTD1 citations62
US9202718B2Dec 1, 2015
Electrostatic chuck
NGK INSULATORS LTD3 citations62
US9188397B2Nov 17, 2015
Dense composite material, method for producing the same, and component for semiconductor production equipment
NGK INSULATORS LTD2 citations62
US9184070B2Nov 10, 2015
Dense composite material, method for manufacturing the same, joined body, and member for semiconductor manufacturing apparatuses
NGK INSULATORS LTD2 citations62
US9257315B2Feb 9, 2016
Cooling plate, method for manufacturing the same, and member for semiconductor manufacturing apparatus
NGK INSULATORS LTD2 citations61
US9255747B2Feb 9, 2016
Cooling plate, method for manufacturing the same, and member for semiconductor manufacturing apparatus
NGK INSULATORS LTD2 citations61
US9892950B2Feb 13, 2018
Ceramic member, member for semiconductor manufacturing apparatus, and method for manufacturing ceramic member
NGK INSULATORS LTD0 citations52
US9437463B2Sep 6, 2016
Heating device
NGK INSULATORS LTD0 citations52
US9287144B2Mar 15, 2016
Heating device
NGK INSULATORS LTD0 citations52
US9184081B2Nov 10, 2015
Electrostatic chuck
NGK INSULATORS LTD0 citations51
WATANABE MORIMICHI
2 patentsUS8541328B2Sep 24, 2013
Ceramic material, member for semiconductor manufacturing equipment, sputtering target member and method for producing ceramic material
WATANABE MORIMICHI5 citations82
US8597776B2Dec 3, 2013
Ceramic material, laminate, member for use in semiconductor manufacturing equipment, and sputtering target member
WATANABE MORIMICHI3 citations60