Inventor
CORBIN DAMYON L
US7 patents
⚠️ This page may combine multiple inventors who share the name “CORBIN DAMYON L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
6 patentsUS10090180B2Oct 2, 2018
Package assembly for thin wafer shipping and method of use
IBM5 citations82
US9543175B2Jan 10, 2017
Package assembly for thin wafer shipping and method of use
IBM6 citations82
US10468280B2Nov 5, 2019
Package assembly for thin wafer shipping and method of use
IBM3 citations71
US8912091B2Dec 16, 2014
Backside metal ground plane with improved metal adhesion and design structures
IBM1 citations51
US10784137B2Sep 22, 2020
Package assembly for thin wafer shipping and method of use
IBM0 citations50
US10622235B2Apr 14, 2020
Package assembly for thin wafer shipping and method of use
IBM0 citations50