Inventor

TANG WEIHUA

US20 patents

⚠️ This page may combine multiple inventors who share the name “TANG WEIHUA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TANG WEIHUA

INTEL CORP

Semiconductor device stack-up with bulk substrate material to mitigate hot spots

Thermoelectric coolers combined with phase-change material in integrated circuit packages

Coupled cooling fins in ultra-small systems

Hybrid backside thermal structures for enhanced IC packages

Thermal spreading management of 3D stacked integrated circuits

Thermal spreading management of 3D stacked integrated circuits

Semiconductor device stack-up with bulk substrate material to mitigate hot spots

Thermally enhanced silicon back end layers for improved thermal performance

Semiconductor device stack-up with bulk substrate material to mitigate hot spots

Sloped metal features for cooling hotspots in stacked-die packages

Package architecture including thermoelectric cooler structures

Hybrid backside thermal structures for enhanced ic packages

Integrated heat spreader with multiple channels for multichip packages

Phase change materials for electromagnetic interference shielding and heat dissipation in integrated circuit assemblies

NXP BV

System and method for performing channel estimation on an OFDM signal

Reduced latency channel-estimation

JIANG HONGJIN

Hybrid solder and filled paste in microelectronic packaging

NXP USA INC

Self-diagnosis system for wireless transceivers with multiple antennas

HEKSTRA ANDRIES PIETER

Power-reduced preliminary decoded bits in viterbi decoders

TANG WEIHUA

Multi-standard viterbi processor