Inventor
JHA CHANDRA M
US11 patents
⚠️ This page may combine multiple inventors who share the name “JHA CHANDRA M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
9 patentsUS10121722B1Nov 6, 2018
Architecture material and process to improve thermal performance of the embedded die package
INTEL CORP12 citations82
US9865521B2Jan 9, 2018
Copper nanorod-based thermal interface material (TIM)
INTEL CORP2 citations72
US10290561B2May 14, 2019
Thermal interfaces for integrated circuit packages
INTEL CORP2 citations71
US11626395B2Apr 11, 2023
Thermal spreading management of 3D stacked integrated circuits
INTEL CORP0 citations62
US11127727B2Sep 21, 2021
Thermal spreading management of 3D stacked integrated circuits
INTEL CORP0 citations62
US11322456B2May 3, 2022
Die back side structures for warpage control
INTEL CORP0 citations59
US11508645B2Nov 22, 2022
Modular technique for die-level liquid cooling
INTEL CORP0 citations50
US10461011B2Oct 29, 2019
Microelectronics package with an integrated heat spreader having indentations
INTEL CORP0 citations50
US10607909B2Mar 31, 2020
Systems, methods, and apparatuses for implementing a thermal solution for 3D packaging
INTEL CORP0 citations40