P

Inventor

WAN ZHIMIN

US57 patents
⚠️ This page may combine multiple inventors who share the name “WAN ZHIMIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

24 patents
US11521914B2Dec 6, 2022

Microelectronic assemblies having a cooling channel

INTEL CORP8 citations86
US11387224B2Jul 12, 2022

Phase change material in substrate cavity

INTEL CORP7 citations84
US12191220B2Jan 7, 2025

Hybrid interposer of glass and silicon to reduce thermal crosstalk

INTEL CORP2 citations75
US11646244B2May 9, 2023

Socket loading mechanism for passive or active socket and package cooling

INTEL CORP4 citations74
US11894282B2Feb 6, 2024

Vented lids for integrated circuit packages

INTEL CORP2 citations72
US11456232B2Sep 27, 2022

Thermal assemblies for multi-chip packages

INTEL CORP4 citations70
US12308299B2May 20, 2025

TEC-embedded dummy die to cool the bottom die edge hotspot

INTEL CORP0 citations62
US11901262B2Feb 13, 2024

Cooling solution including microchannel arrays and methods of forming the same

INTEL CORP0 citations62
US11854931B2Dec 26, 2023

STIM/liquid metal filled laser drill trench to improve cooling of stacked bottom die

INTEL CORP0 citations62
US11837519B2Dec 5, 2023

Heatsink cutout and insulating through silicon vias to cut thermal cross-talk

INTEL CORP0 citations62
US11626395B2Apr 11, 2023

Thermal spreading management of 3D stacked integrated circuits

INTEL CORP0 citations62
US11581671B2Feb 14, 2023

Integrated circuit package socket housing to enhance package cooling

INTEL CORP0 citations62
US11127727B2Sep 21, 2021

Thermal spreading management of 3D stacked integrated circuits

INTEL CORP0 citations62
US11398414B2Jul 26, 2022

Sloped metal features for cooling hotspots in stacked-die packages

INTEL CORP0 citations61
US12266589B2Apr 1, 2025

Enhanced base die heat path using through-silicon vias

INTEL CORP0 citations59
US12057369B2Aug 6, 2024

Enhanced base die heat path using through-silicon vias

INTEL CORP0 citations59
US11854935B2Dec 26, 2023

Enhanced base die heat path using through-silicon vias

INTEL CORP0 citations59
US11444003B2Sep 13, 2022

Integrated heat spreader with multiple channels for multichip packages

INTEL CORP1 citations58
US12094800B2Sep 17, 2024

Thermally conductive slugs/active dies to improve cooling of stacked bottom dies

INTEL CORP0 citations52
US11670561B2Jun 6, 2023

3D buildup of thermally conductive layers to resolve die height differences

INTEL CORP0 citations52
US12046536B2Jul 23, 2024

Integrated heat spreader with enhanced vapor chamber for multichip packages

INTEL CORP0 citations51
US11482471B2Oct 25, 2022

Thermal management solutions for integrated circuit packages

INTEL CORP0 citations51
US11502017B2Nov 15, 2022

Effective heat conduction from hotspot to heat spreader through package substrate

INTEL CORP0 citations50
US11222877B2Jan 11, 2022

Thermally coupled package-on-package semiconductor packages

INTEL CORP0 citations47

ADVANCED ION BEAM TECH INC

15 patents
US9450078B1Sep 20, 2016

Forming punch-through stopper regions in finFET devices

ADVANCED ION BEAM TECH INC20 citations92
US8673753B1Mar 18, 2014

Multi-energy ion implantation

ADVANCED ION BEAM TECH INC8 citations84
US9697988B2Jul 4, 2017

Ion implantation system and process

ADVANCED ION BEAM TECH INC2 citations73
US9852887B2Dec 26, 2017

Ion source of an ion implanter

ADVANCED ION BEAM TECH INC6 citations71
US9340870B2May 17, 2016

Magnetic field fluctuation for beam smoothing

ADVANCED ION BEAM TECH INC3 citations70
US9057129B2Jun 16, 2015

Implant method and implanter by using a variable aperture

ADVANCED ION BEAM TECH INC3 citations60
US9117629B2Aug 25, 2015

Multi-energy ion implantation

ADVANCED ION BEAM TECH INC0 citations52
US9824850B2Nov 21, 2017

Deceleration apparatus for ribbon and spot beams

ADVANCED ION BEAM TECH INC0 citations50
US8987691B2Mar 24, 2015

Ion implanter and ion implant method thereof

ADVANCED ION BEAM TECH INC0 citations50
US8039374B2Oct 18, 2011

Method for low temperature ion implantation

ADVANCED ION BEAM TECH INC0 citations50
US10361059B2Jul 23, 2019

Magnetic field fluctuation for beam smoothing

ADVANCED ION BEAM TECH INC0 citations49
US9431247B2Aug 30, 2016

Method for ion implantation

ADVANCED ION BEAM TECH INC1 citations48
US12170182B2Dec 17, 2024

Ribbon beam angle adjustment in an ion implantation system

ADVANCED ION BEAM TECH INC0 citations47
US9147550B2Sep 29, 2015

Gas mixture method and apparatus for generating ion beam

ADVANCED ION BEAM TECH INC0 citations47
US8907301B1Dec 9, 2014

Gas mixture method for generating ion beam

ADVANCED ION BEAM TECH INC1 citations47

ADVANCED ION BEAM TECHNOLOGY I

5 patents

ADVANCED OPTICAL SOLUTIONS INC

1 patent

LIN WEI-CHENG

1 patent

KOPALIDIS PETER M

1 patent

AXCHLISRTECHNOLOGIES INC

1 patent

WHITE NICHOLAS

1 patent

LAM RES CORP

1 patent

Showing the top 50 of 57 patents by PatentIndex Score.