Inventor
WAN ZHIMIN
US57 patents
⚠️ This page may combine multiple inventors who share the name “WAN ZHIMIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
24 patentsUS11521914B2Dec 6, 2022
Microelectronic assemblies having a cooling channel
INTEL CORP8 citations86
US11387224B2Jul 12, 2022
Phase change material in substrate cavity
INTEL CORP7 citations84
US12191220B2Jan 7, 2025
Hybrid interposer of glass and silicon to reduce thermal crosstalk
INTEL CORP2 citations75
US11646244B2May 9, 2023
Socket loading mechanism for passive or active socket and package cooling
INTEL CORP4 citations74
US11894282B2Feb 6, 2024
Vented lids for integrated circuit packages
INTEL CORP2 citations72
US11456232B2Sep 27, 2022
Thermal assemblies for multi-chip packages
INTEL CORP4 citations70
US12308299B2May 20, 2025
TEC-embedded dummy die to cool the bottom die edge hotspot
INTEL CORP0 citations62
US11901262B2Feb 13, 2024
Cooling solution including microchannel arrays and methods of forming the same
INTEL CORP0 citations62
US11854931B2Dec 26, 2023
STIM/liquid metal filled laser drill trench to improve cooling of stacked bottom die
INTEL CORP0 citations62
US11837519B2Dec 5, 2023
Heatsink cutout and insulating through silicon vias to cut thermal cross-talk
INTEL CORP0 citations62
US11626395B2Apr 11, 2023
Thermal spreading management of 3D stacked integrated circuits
INTEL CORP0 citations62
US11581671B2Feb 14, 2023
Integrated circuit package socket housing to enhance package cooling
INTEL CORP0 citations62
US11127727B2Sep 21, 2021
Thermal spreading management of 3D stacked integrated circuits
INTEL CORP0 citations62
US11398414B2Jul 26, 2022
Sloped metal features for cooling hotspots in stacked-die packages
INTEL CORP0 citations61
US12266589B2Apr 1, 2025
Enhanced base die heat path using through-silicon vias
INTEL CORP0 citations59
US12057369B2Aug 6, 2024
Enhanced base die heat path using through-silicon vias
INTEL CORP0 citations59
US11854935B2Dec 26, 2023
Enhanced base die heat path using through-silicon vias
INTEL CORP0 citations59
US11444003B2Sep 13, 2022
Integrated heat spreader with multiple channels for multichip packages
INTEL CORP1 citations58
US12094800B2Sep 17, 2024
Thermally conductive slugs/active dies to improve cooling of stacked bottom dies
INTEL CORP0 citations52
US11670561B2Jun 6, 2023
3D buildup of thermally conductive layers to resolve die height differences
INTEL CORP0 citations52
US12046536B2Jul 23, 2024
Integrated heat spreader with enhanced vapor chamber for multichip packages
INTEL CORP0 citations51
US11482471B2Oct 25, 2022
Thermal management solutions for integrated circuit packages
INTEL CORP0 citations51
US11502017B2Nov 15, 2022
Effective heat conduction from hotspot to heat spreader through package substrate
INTEL CORP0 citations50
US11222877B2Jan 11, 2022
Thermally coupled package-on-package semiconductor packages
INTEL CORP0 citations47
ADVANCED ION BEAM TECH INC
15 patentsUS9450078B1Sep 20, 2016
Forming punch-through stopper regions in finFET devices
ADVANCED ION BEAM TECH INC20 citations92
US8673753B1Mar 18, 2014
Multi-energy ion implantation
ADVANCED ION BEAM TECH INC8 citations84
US9697988B2Jul 4, 2017
Ion implantation system and process
ADVANCED ION BEAM TECH INC2 citations73
US9852887B2Dec 26, 2017
Ion source of an ion implanter
ADVANCED ION BEAM TECH INC6 citations71
US9340870B2May 17, 2016
Magnetic field fluctuation for beam smoothing
ADVANCED ION BEAM TECH INC3 citations70
US9057129B2Jun 16, 2015
Implant method and implanter by using a variable aperture
ADVANCED ION BEAM TECH INC3 citations60
US9117629B2Aug 25, 2015
Multi-energy ion implantation
ADVANCED ION BEAM TECH INC0 citations52
US9824850B2Nov 21, 2017
Deceleration apparatus for ribbon and spot beams
ADVANCED ION BEAM TECH INC0 citations50
US8987691B2Mar 24, 2015
Ion implanter and ion implant method thereof
ADVANCED ION BEAM TECH INC0 citations50
US8039374B2Oct 18, 2011
Method for low temperature ion implantation
ADVANCED ION BEAM TECH INC0 citations50
US10361059B2Jul 23, 2019
Magnetic field fluctuation for beam smoothing
ADVANCED ION BEAM TECH INC0 citations49
US9431247B2Aug 30, 2016
Method for ion implantation
ADVANCED ION BEAM TECH INC1 citations48
US12170182B2Dec 17, 2024
Ribbon beam angle adjustment in an ion implantation system
ADVANCED ION BEAM TECH INC0 citations47
US9147550B2Sep 29, 2015
Gas mixture method and apparatus for generating ion beam
ADVANCED ION BEAM TECH INC0 citations47
US8907301B1Dec 9, 2014
Gas mixture method for generating ion beam
ADVANCED ION BEAM TECH INC1 citations47
ADVANCED ION BEAM TECHNOLOGY I
5 patentsUS6806479B1Oct 19, 2004
Apparatus and method for reducing implant angle variations across a large wafer for a batch disk
ADVANCED ION BEAM TECHNOLOGY I18 citations92
US7745804B1Jun 29, 2010
Ion implantation method and application thereof
ADVANCED ION BEAM TECHNOLOGY I8 citations84
US6918351B2Jul 19, 2005
Apparatus for ion beam implantation
ADVANCED ION BEAM TECHNOLOGY I12 citations84
US7750323B1Jul 6, 2010
Ion implanter and method for implanting a wafer
ADVANCED ION BEAM TECHNOLOGY I13 citations81
US7807986B1Oct 5, 2010
Ion implanter and method for adjusting ion beam
ADVANCED ION BEAM TECHNOLOGY I5 citations58
ADVANCED OPTICAL SOLUTIONS INC
1 patentLIN WEI-CHENG
1 patentKOPALIDIS PETER M
1 patentAXCHLISRTECHNOLOGIES INC
1 patentWHITE NICHOLAS
1 patentLAM RES CORP
1 patentShowing the top 50 of 57 patents by PatentIndex Score.