Inventor
CHENG YU-HUNG
TW79 patents
⚠️ This page may combine multiple inventors who share the name “CHENG YU-HUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
40 patentsUS9899441B1Feb 20, 2018
Deep trench isolation (DTI) structure with a tri-layer passivation layer
TAIWAN SEMICONDUCTOR MFG CO LTD17 citations86
US10658410B2May 19, 2020
Image sensor having improved full well capacity and related method of formation
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84
US10553474B1Feb 4, 2020
Method for forming a semiconductor-on-insulator (SOI) substrate
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US10453757B2Oct 22, 2019
Transistor channel
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10395974B1Aug 27, 2019
Method for forming a thin semiconductor-on-insulator (SOI) substrate
TAIWAN SEMICONDUCTOR MFG CO LTD11 citations84
US10147756B2Dec 4, 2018
Deep trench isolation structure and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US9978650B2May 22, 2018
Transistor channel
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84
US9905600B1Feb 27, 2018
Image sensor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US9799702B2Oct 24, 2017
Deep trench isolation structure and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US9653574B2May 16, 2017
Selective etching in the formation of epitaxy regions in MOS devices
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10569520B2Feb 25, 2020
Wafer debonding system and method
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations83
US10155369B2Dec 18, 2018
Wafer debonding system and method
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations83
US10147609B2Dec 4, 2018
Semiconductor epitaxy bordering isolation structure
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations83
US11869761B2Jan 9, 2024
Back-side deep trench isolation structure for image sensor
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations74
US11855159B2Dec 26, 2023
Method for forming thin semiconductor-on-insulator (SOI) substrates
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11594597B2Feb 28, 2023
Selective polysilicon growth for deep trench polysilicon isolation structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11545513B2Jan 3, 2023
Image sensor having improved full well capacity and related method of formation
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11495489B2Nov 8, 2022
Method for forming a semiconductor-on-insulator (SOI) substrate
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10971534B2Apr 6, 2021
Image sensor having improved full well capacity and related method of formation
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10923503B2Feb 16, 2021
Semiconductor-on-insulator (SOI) substrate comprising a trap-rich layer with small grain sizes
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10756222B2Aug 25, 2020
Backside illuminated photo-sensitive device with gradated buffer layer
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10658474B2May 19, 2020
Method for forming thin semiconductor-on-insulator (SOI) substrates
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10109756B2Oct 23, 2018
Backside illuminated photo-sensitive device with gradated buffer layer
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9887235B2Feb 6, 2018
Pixel isolation device and fabrication method
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9425287B2Aug 23, 2016
Reducing variation by using combination epitaxy growth
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10957540B2Mar 23, 2021
Semiconductor epitaxy bordering isolation structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10889097B2Jan 12, 2021
Wafer debonding system and method
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US10522353B2Dec 31, 2019
Semiconductor epitaxy bordering isolation structure
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US10516040B2Dec 24, 2019
Method of forming epitaxial silicon layer and semiconductor device thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US9679980B2Jun 13, 2017
Common source oxide formation by in-situ steam oxidation for embedded flash
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations70
US11817469B2Nov 14, 2023
Light absorbing layer to enhance P-type diffusion for DTI in image sensors
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations67
US12165911B2Dec 10, 2024
Method for forming a semiconductor-on-insulator (SOI) substrate
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12074036B2Aug 27, 2024
Multi-layered polysilicon and oxygen-doped polysilicon design for RF SOI trap-rich poly layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11830764B2Nov 28, 2023
Method for forming a semiconductor-on-insulator (SOI) substrate
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11611005B2Mar 21, 2023
Backside illuminated photo-sensitive device with gradated buffer layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11264469B2Mar 1, 2022
Method for forming thin semiconductor-on-insulator (SOI) substrates
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11171015B2Nov 9, 2021
Multi-layered polysilicon and oxygen-doped polysilicon design for RF SOI trap-rich poly layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US9099324B2Aug 4, 2015
Semiconductor device with trench isolation
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations63
US12557391B2Feb 17, 2026
Method for forming semiconductor-on-insulator (SOI) substrate and recycle substrate
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12557610B2Feb 17, 2026
Multilayer isolation structure for high voltage silicon-on-insulator device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
CHENG YU-HUNG
6 patentsUS9263339B2Feb 16, 2016
Selective etching in the formation of epitaxy regions in MOS devices
CHENG YU-HUNG10 citations84
US8828850B2Sep 9, 2014
Reducing variation by using combination epitaxy growth
CHENG YU-HUNG9 citations84
US8455930B2Jun 4, 2013
Strained semiconductor device with facets
CHENG YU-HUNG12 citations84
US8530316B2Sep 10, 2013
Method for fabricating a semiconductor device
CHENG YU-HUNG6 citations83
US9064688B2Jun 23, 2015
Performing enhanced cleaning in the formation of MOS devices
CHENG YU-HUNG8 citations82
US8446126B2May 21, 2013
Power bank apparatus with speaker
CHENG YU-HUNG6 citations73
TAIWAN SEMICONDUCTOR MFG
3 patentsUS9142643B2Sep 22, 2015
Method for forming epitaxial feature
TAIWAN SEMICONDUCTOR MFG25 citations93
US8946060B2Feb 3, 2015
Methods of manufacturing strained semiconductor devices with facets
TAIWAN SEMICONDUCTOR MFG12 citations84
US8377784B2Feb 19, 2013
Method for fabricating a semiconductor device
TAIWAN SEMICONDUCTOR MFG12 citations84
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