P

Inventor

CHENG YU-HUNG

TW79 patents
⚠️ This page may combine multiple inventors who share the name “CHENG YU-HUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

40 patents
US9899441B1Feb 20, 2018

Deep trench isolation (DTI) structure with a tri-layer passivation layer

TAIWAN SEMICONDUCTOR MFG CO LTD17 citations86
US10658410B2May 19, 2020

Image sensor having improved full well capacity and related method of formation

TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84
US10553474B1Feb 4, 2020

Method for forming a semiconductor-on-insulator (SOI) substrate

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US10453757B2Oct 22, 2019

Transistor channel

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10395974B1Aug 27, 2019

Method for forming a thin semiconductor-on-insulator (SOI) substrate

TAIWAN SEMICONDUCTOR MFG CO LTD11 citations84
US10147756B2Dec 4, 2018

Deep trench isolation structure and method of forming same

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US9978650B2May 22, 2018

Transistor channel

TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84
US9905600B1Feb 27, 2018

Image sensor device and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US9799702B2Oct 24, 2017

Deep trench isolation structure and method of forming same

TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US9653574B2May 16, 2017

Selective etching in the formation of epitaxy regions in MOS devices

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10569520B2Feb 25, 2020

Wafer debonding system and method

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations83
US10155369B2Dec 18, 2018

Wafer debonding system and method

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations83
US10147609B2Dec 4, 2018

Semiconductor epitaxy bordering isolation structure

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations83
US11869761B2Jan 9, 2024

Back-side deep trench isolation structure for image sensor

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations74
US11855159B2Dec 26, 2023

Method for forming thin semiconductor-on-insulator (SOI) substrates

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11594597B2Feb 28, 2023

Selective polysilicon growth for deep trench polysilicon isolation structure

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11545513B2Jan 3, 2023

Image sensor having improved full well capacity and related method of formation

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11495489B2Nov 8, 2022

Method for forming a semiconductor-on-insulator (SOI) substrate

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10971534B2Apr 6, 2021

Image sensor having improved full well capacity and related method of formation

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10923503B2Feb 16, 2021

Semiconductor-on-insulator (SOI) substrate comprising a trap-rich layer with small grain sizes

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10756222B2Aug 25, 2020

Backside illuminated photo-sensitive device with gradated buffer layer

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10658474B2May 19, 2020

Method for forming thin semiconductor-on-insulator (SOI) substrates

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10109756B2Oct 23, 2018

Backside illuminated photo-sensitive device with gradated buffer layer

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9887235B2Feb 6, 2018

Pixel isolation device and fabrication method

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9425287B2Aug 23, 2016

Reducing variation by using combination epitaxy growth

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10957540B2Mar 23, 2021

Semiconductor epitaxy bordering isolation structure

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10889097B2Jan 12, 2021

Wafer debonding system and method

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US10522353B2Dec 31, 2019

Semiconductor epitaxy bordering isolation structure

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US10516040B2Dec 24, 2019

Method of forming epitaxial silicon layer and semiconductor device thereof

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US9679980B2Jun 13, 2017

Common source oxide formation by in-situ steam oxidation for embedded flash

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations70
US11817469B2Nov 14, 2023

Light absorbing layer to enhance P-type diffusion for DTI in image sensors

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations67
US12165911B2Dec 10, 2024

Method for forming a semiconductor-on-insulator (SOI) substrate

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12074036B2Aug 27, 2024

Multi-layered polysilicon and oxygen-doped polysilicon design for RF SOI trap-rich poly layer

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11830764B2Nov 28, 2023

Method for forming a semiconductor-on-insulator (SOI) substrate

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11611005B2Mar 21, 2023

Backside illuminated photo-sensitive device with gradated buffer layer

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11264469B2Mar 1, 2022

Method for forming thin semiconductor-on-insulator (SOI) substrates

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11171015B2Nov 9, 2021

Multi-layered polysilicon and oxygen-doped polysilicon design for RF SOI trap-rich poly layer

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US9099324B2Aug 4, 2015

Semiconductor device with trench isolation

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations63
US12557391B2Feb 17, 2026

Method for forming semiconductor-on-insulator (SOI) substrate and recycle substrate

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12557610B2Feb 17, 2026

Multilayer isolation structure for high voltage silicon-on-insulator device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

CHENG YU-HUNG

6 patents

TAIWAN SEMICONDUCTOR MFG

3 patents

LEE YEN-RU

1 patent

Showing the top 50 of 79 patents by PatentIndex Score.