Inventor
LIU HSIANG
TW11 patents
⚠️ This page may combine multiple inventors who share the name “LIU HSIANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
8 patentsUS10147609B2Dec 4, 2018
Semiconductor epitaxy bordering isolation structure
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations83
US10957540B2Mar 23, 2021
Semiconductor epitaxy bordering isolation structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10522353B2Dec 31, 2019
Semiconductor epitaxy bordering isolation structure
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US10658296B2May 19, 2020
Dielectric film for semiconductor fabrication
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations71
US11658032B2May 23, 2023
Semiconductor epitaxy bordering isolation structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11901295B2Feb 13, 2024
Dielectric film for semiconductor fabrication
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11296027B2Apr 5, 2022
Dielectric film for semiconductor fabrication
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11152306B2Oct 19, 2021
Dielectric film for semiconductor fabrication
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
TAIWAN SEMICONDUCTOR MFG
3 patentsUS5824457AOct 20, 1998
Use of WEE (wafer edge exposure) to prevent polyimide contamination
TAIWAN SEMICONDUCTOR MFG45 citations93
US6214441B1Apr 10, 2001
Use of wee (water edge exposure) to prevent polyimide
TAIWAN SEMICONDUCTOR MFG11 citations70
US6001681ADec 14, 1999
Method to reduce the depth of a buried contact trench by using a thin split polysilicon thickness
TAIWAN SEMICONDUCTOR MFG10 citations65