Inventor
LEE YU-YING
TW24 patents
⚠️ This page may combine multiple inventors who share the name “LEE YU-YING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED SEMICONDUCTOR ENG
22 patentsUS10446411B2Oct 15, 2019
Semiconductor device package with a conductive post
ADVANCED SEMICONDUCTOR ENG5 citations82
US11469165B2Oct 11, 2022
Semiconductor device package
ADVANCED SEMICONDUCTOR ENG1 citations72
US10741482B2Aug 11, 2020
Semiconductor device package
ADVANCED SEMICONDUCTOR ENG2 citations72
US10515884B2Dec 24, 2019
Substrate having a conductive structure within photo-sensitive resin
ADVANCED SEMICONDUCTOR ENG2 citations72
US9984989B2May 29, 2018
Semiconductor substrate and semiconductor package structure
ADVANCED SEMICONDUCTOR ENG2 citations72
US11211536B2Dec 28, 2021
Semiconductor device package and a method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG1 citations71
US10224298B2Mar 5, 2019
Semiconductor package device having glass transition temperature greater than binding layer temperature
ADVANCED SEMICONDUCTOR ENG2 citations71
US10049893B2Aug 14, 2018
Semiconductor device with a conductive post
ADVANCED SEMICONDUCTOR ENG4 citations71
US12315785B2May 27, 2025
Semiconductor device package
ADVANCED SEMICONDUCTOR ENG0 citations62
US12033934B2Jul 9, 2024
Package structure, optical structure and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations62
US11862550B2Jan 2, 2024
Electronic package structure and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations62
US11569179B2Jan 31, 2023
Package structure including an outer lead portion and an inner lead portion and method for manufacturing package structure
ADVANCED SEMICONDUCTOR ENG0 citations62
US10483196B2Nov 19, 2019
Embedded trace substrate structure and semiconductor package structure including the same
ADVANCED SEMICONDUCTOR ENG1 citations62
US11784296B2Oct 10, 2023
Semiconductor device package and a method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations61
US10734337B2Aug 4, 2020
Semiconductor package device having glass transition temperature greater than binding layer temperature
ADVANCED SEMICONDUCTOR ENG0 citations51
US10103110B2Oct 16, 2018
Semiconductor package structure and fabrication method thereof
ADVANCED SEMICONDUCTOR ENG0 citations51
US10049976B2Aug 14, 2018
Semiconductor substrate and manufacturing method thereof
ADVANCED SEMICONDUCTOR ENG0 citations51
US9911702B2Mar 6, 2018
Semiconductor package structure and fabrication method thereof
ADVANCED SEMICONDUCTOR ENG1 citations51
US10665765B2May 26, 2020
Semiconductor device package and a method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations50
US9054118B2Jun 9, 2015
Heat dissipating semiconductor device packages and related methods
ADVANCED SEMICONDUCTOR ENG1 citations49
US10879159B2Dec 29, 2020
Substrate, semiconductor package thereof and process of making same
ADVANCED SEMICONDUCTOR ENG0 citations41
US10002843B2Jun 19, 2018
Semiconductor substrate structure, semiconductor package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations41