Inventor
WANG ZHIQI
CN34 patents
⚠️ This page may combine multiple inventors who share the name “WANG ZHIQI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CHINA WAFER LEVEL CSP CO LTD
24 patentsUS10276540B2Apr 30, 2019
Chip packaging method and chip packaging structure
CHINA WAFER LEVEL CSP CO LTD3 citations73
US10133907B2Nov 20, 2018
Fingerprint recognition chip packaging structure and packaging method
CHINA WAFER LEVEL CSP CO LTD5 citations72
US10090217B2Oct 2, 2018
Chip packaging method and package structure
CHINA WAFER LEVEL CSP CO LTD2 citations72
US9748162B2Aug 29, 2017
Chip to wafer package with top electrodes and method of forming
CHINA WAFER LEVEL CSP CO LTD2 citations72
US10541186B2Jan 21, 2020
Chip package and chip packaging method
CHINA WAFER LEVEL CSP CO LTD2 citations66
US10763293B2Sep 1, 2020
Image sensing chip package and image sensing chip packaging method
CHINA WAFER LEVEL CSP CO LTD1 citations62
US10325946B2Jun 18, 2019
Packaging method and package structure for image sensing chip
CHINA WAFER LEVEL CSP CO LTD1 citations57
US11049899B2Jun 29, 2021
Encapsulation structure of image sensing chip, and encapsulation method therefor
CHINA WAFER LEVEL CSP CO LTD1 citations53
US10685917B2Jun 16, 2020
Semiconductor device and manufacture method of the same
CHINA WAFER LEVEL CSP CO LTD0 citations51
US10126151B2Nov 13, 2018
Wafer-level chip package structure and packaging method
CHINA WAFER LEVEL CSP CO LTD1 citations51
US10108837B2Oct 23, 2018
Fingerprint recognition chip packaging structure and packaging method
CHINA WAFER LEVEL CSP CO LTD1 citations51
US9601531B2Mar 21, 2017
Wafer-level packaging structure for image sensors with packaging cover dike structures corresponding to scribe line regions
CHINA WAFER LEVEL CSP CO LTD1 citations51
US9231018B2Jan 5, 2016
Wafer level packaging structure for image sensors and wafer level packaging method for image sensors
CHINA WAFER LEVEL CSP CO LTD0 citations51
US10283483B2May 7, 2019
Packaging method and package structure for image sensing chip
CHINA WAFER LEVEL CSP CO LTD0 citations47
US10680033B2Jun 9, 2020
Chip packaging method and chip package
CHINA WAFER LEVEL CSP CO LTD0 citations41
US10541264B2Jan 21, 2020
Package-on-package structure and package-on-package method
CHINA WAFER LEVEL CSP CO LTD0 citations41
US10529758B2Jan 7, 2020
Packaging method and packaging structure
CHINA WAFER LEVEL CSP CO LTD0 citations40
US10096643B2Oct 9, 2018
Fingerprint recognition chip packaging structure and packaging method
CHINA WAFER LEVEL CSP CO LTD0 citations40
US9299735B2Mar 29, 2016
Image sensor package structure and method
CHINA WAFER LEVEL CSP CO LTD0 citations40
US10541262B2Jan 21, 2020
Image sensing chip packaging structure and packaging method
CHINA WAFER LEVEL CSP CO LTD0 citations36
US10817700B2Oct 27, 2020
Optical fingerprint recognition chip package and packaging method
CHINA WAFER LEVEL CSP CO LTD0 citations34
US10497728B2Dec 3, 2019
Fingerprint sensing chip packaging method and fingerprint sensing chip package
CHINA WAFER LEVEL CSP CO LTD0 citations34
US10418296B2Sep 17, 2019
Semiconductor chip package structure and packaging method therefor
CHINA WAFER LEVEL CSP CO LTD0 citations31
US10490583B2Nov 26, 2019
Packaging structure and packaging method
CHINA WAFER LEVEL CSP CO LTD0 citations30