Inventor
XIE GUOLIANG
CN6 patents
⚠️ This page may combine multiple inventors who share the name “XIE GUOLIANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CHINA WAFER LEVEL CSP CO LTD
5 patentsUS10541186B2Jan 21, 2020
Chip package and chip packaging method
CHINA WAFER LEVEL CSP CO LTD2 citations66
US10325946B2Jun 18, 2019
Packaging method and package structure for image sensing chip
CHINA WAFER LEVEL CSP CO LTD1 citations57
US10283483B2May 7, 2019
Packaging method and package structure for image sensing chip
CHINA WAFER LEVEL CSP CO LTD0 citations47
US10541262B2Jan 21, 2020
Image sensing chip packaging structure and packaging method
CHINA WAFER LEVEL CSP CO LTD0 citations36
US10817700B2Oct 27, 2020
Optical fingerprint recognition chip package and packaging method
CHINA WAFER LEVEL CSP CO LTD0 citations34