Inventor
NAKAMURA EIJI I
JP11 patents
⚠️ This page may combine multiple inventors who share the name “NAKAMURA EIJI I”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
10 patentsUS9859241B1Jan 2, 2018
Method of forming a solder bump structure
IBM20 citations93
US10741514B2Aug 11, 2020
Fabrication of solder balls with injection molded solder
IBM2 citations72
US10037958B2Jul 31, 2018
Fabrication of solder balls with injection molded solder
IBM2 citations72
US9837367B1Dec 5, 2017
Fabrication of solder balls with injection molded solder
IBM2 citations72
US10325839B2Jun 18, 2019
Reduction of stress in via structure
IBM1 citations62
US10692829B2Jun 23, 2020
Method of forming a solder bump structure
IBM0 citations51
US10607956B2Mar 31, 2020
Method of forming a solder bump structure
IBM0 citations51
US10566302B2Feb 18, 2020
Fabrication of solder balls with injection molded solder
IBM0 citations51
US10553553B2Feb 4, 2020
Method of forming a solder bump structure
IBM0 citations51
US10103118B2Oct 16, 2018
Fabrication of solder balls with injection molded solder
IBM0 citations51