Inventor
WRIGHT STEVEN LORENZ
US19 patents
⚠️ This page may combine multiple inventors who share the name “WRIGHT STEVEN LORENZ”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
18 patentsUS6690383B1Feb 10, 2004
Color calibration of displays
IBM76 citations95
US11164817B2Nov 2, 2021
Multi-chip package structures with discrete redistribution layers
IBM32 citations94
US11094637B2Aug 17, 2021
Multi-chip package structures having embedded chip interconnect bridges and fan-out redistribution layers
IBM17 citations94
US6697037B1Feb 24, 2004
TFT LCD active data line repair
IBM56 citations93
US7492821B2Feb 17, 2009
System and method for selective image capture, transmission and reconstruction
IBM25 citations89
US6870643B2Mar 22, 2005
Method and system for error diffusion with a plurality of error measures
IBM12 citations84
US11574875B2Feb 7, 2023
Multi-chip package structures having embedded chip interconnect bridges and fan-out redistribution layers
IBM2 citations73
US11133259B2Sep 28, 2021
Multi-chip package structure having high density chip interconnect bridge with embedded power distribution network
IBM4 citations73
US10032943B2Jul 24, 2018
Device layer thin-film transfer to thermally conductive substrate
IBM3 citations72
US12119335B2Oct 15, 2024
Interconnection structures for high bandwidth data transfer
IBM0 citations62
US11587896B2Feb 21, 2023
Transferrable pillar structure for fanout package or interconnect bridge
IBM0 citations62
US11114410B2Sep 7, 2021
Multi-chip package structures formed by joining chips to pre-positioned chip interconnect bridge devices
IBM0 citations62
US7501708B2Mar 10, 2009
Microelectronic device connection structure
IBM4 citations62
US7282391B1Oct 16, 2007
Method for precision assembly of integrated circuit chip packages
IBM5 citations62
US7615405B2Nov 10, 2009
Method for precision assembly of integrated circuit chip packages
IBM0 citations52
US10396220B2Aug 27, 2019
Device layer thin-film transfer to thermally conductive substrate
IBM0 citations49
US10243091B2Mar 26, 2019
Device layer thin-film transfer to thermally conductive substrate
IBM0 citations49
US12183702B2Dec 31, 2024
Electronic package with varying interconnects
IBM0 citations47