Inventor

HILL DARRELL GLENN

US19 patents

⚠️ This page may combine multiple inventors who share the name “HILL DARRELL GLENN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HILL DARRELL GLENN

NXP USA INC

Transistor die with output bondpad at the input side of the die, and power amplifiers including such dies

Power amplifier devices containing inverted power transistor dies and methods for the fabrication thereof

Transistor with non-circular via connections in two orientations

Transistor with non-circular via connections in two orientations

Multi-path amplifier circuit or system and methods of implementation thereof

Semiconductor devices with a protection layer and methods of fabrication

Circuit die with isolation test structure

Through substrate via (TSV) validation structure for an integrated circuit and method to form the TSV validation structure

Through substrate via (TSV) validation structure for an integrated circuit and method to form the TSV validation structure

ESD protection for depletion-mode devices

Semiconductor device with selectively etched surface passivation

Using a backside mask layer for forming a unique die mark identifier pattern

Transistor with aligned field plate and method of fabrication therefor

Transistor with dielectric spacers and field plate and method of fabrication therefor

Transistor with dielectric spacers and method of fabrication therefor

Transistor with odd-mode oscillation stabilization circuit

Transistor with defect mitigation structures

TRIQUINT SEMICONDUCTOR INC

Method for reducing extrinsic base-collector capacitance

TEXAS INSTRUMENTS INC

Microwave heterojunction bipolar transistors with emitters designed for high power applications and method for fabricating same