Inventor
PETHE SHIRISH
US5 patents
Patents
5 patentsUS11075165B2Jul 27, 2021
Methods and apparatus for forming dual metal interconnects
APPLIED MATERIALS INC2 citations69
US10892186B2Jan 12, 2021
Integration of ALD copper with high temperature PVD copper deposition for BEOL interconnect
APPLIED MATERIALS INC0 citations61
US11948885B2Apr 2, 2024
Methods and apparatus for forming dual metal interconnects
APPLIED MATERIALS INC0 citations59
US11289329B2Mar 29, 2022
Methods and apparatus for filling a feature disposed in a substrate
APPLIED MATERIALS INC0 citations58
US11562925B2Jan 24, 2023
Method of depositing multilayer stack including copper over features of a device structure
APPLIED MATERIALS INC0 citations51