Inventor
LEE JOUNG JOO
US41 patents
⚠️ This page may combine multiple inventors who share the name “LEE JOUNG JOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
37 patentsUS9460959B1Oct 4, 2016
Methods for pre-cleaning conductive interconnect structures
APPLIED MATERIALS INC113 citations97
US11810770B2Nov 7, 2023
Methods and apparatus for controlling ion fraction in physical vapor deposition processes
APPLIED MATERIALS INC2 citations73
US11037768B2Jun 15, 2021
Methods and apparatus for controlling ion fraction in physical vapor deposition processes
APPLIED MATERIALS INC4 citations73
US9953813B2Apr 24, 2018
Methods and apparatus for improved metal ion filtering
APPLIED MATERIALS INC2 citations73
US9831074B2Nov 28, 2017
Bipolar collimator utilized in a physical vapor deposition chamber
APPLIED MATERIALS INC3 citations73
US12022650B2Jun 25, 2024
Low resistivity DRAM buried word line stack
APPLIED MATERIALS INC2 citations72
US11587936B2Feb 21, 2023
Low resistivity DRAM buried word line stack
APPLIED MATERIALS INC2 citations72
US10157733B2Dec 18, 2018
Methods for igniting a plasma in a substrate processing chamber
APPLIED MATERIALS INC2 citations72
US11075165B2Jul 27, 2021
Methods and apparatus for forming dual metal interconnects
APPLIED MATERIALS INC2 citations69
US12453086B2Oct 21, 2025
Low resistivity metal contact stack
APPLIED MATERIALS INC0 citations62
US12281387B2Apr 22, 2025
Method of depositing metal films
APPLIED MATERIALS INC0 citations62
US12094699B2Sep 17, 2024
Methods and apparatus for controlling ion fraction in physical vapor deposition processes
APPLIED MATERIALS INC0 citations62
US11776805B2Oct 3, 2023
Selective oxidation and simplified pre-clean
APPLIED MATERIALS INC0 citations62
US9315891B2Apr 19, 2016
Methods for processing a substrate using multiple substrate support positions
APPLIED MATERIALS INC2 citations62
US12183631B2Dec 31, 2024
Methods for copper doped hybrid metallization for line and via
APPLIED MATERIALS INC0 citations61
US12571092B2Mar 10, 2026
Integrated methods for graphene formation
APPLIED MATERIALS INC0 citations60
US12104243B2Oct 1, 2024
Methods and apparatus for processing a substrate
APPLIED MATERIALS INC0 citations60
US11222816B2Jan 11, 2022
Methods and apparatus for semi-dynamic bottom up reflow
APPLIED MATERIALS INC0 citations60
US10815561B2Oct 27, 2020
Method and apparatus for asymmetric selective physical vapor deposition
APPLIED MATERIALS INC1 citations60
US11948885B2Apr 2, 2024
Methods and apparatus for forming dual metal interconnects
APPLIED MATERIALS INC0 citations59
US12553129B2Feb 17, 2026
Electrochemical reduction of surface metal oxides
APPLIED MATERIALS INC0 citations57
US12315735B2May 27, 2025
Methods for removing etch stop layers
APPLIED MATERIALS INC0 citations57
US12529147B2Jan 20, 2026
Low-k and tantalum nitride barrier recovery using a soak process
APPLIED MATERIALS INC0 citations56
US12094785B2Sep 17, 2024
Dual silicide process using ruthenium silicide
APPLIED MATERIALS INC0 citations56
US10950448B2Mar 16, 2021
Film quality control in a linear scan physical vapor deposition process
APPLIED MATERIALS INC0 citations52
US10927451B2Feb 23, 2021
Methods and apparatus for patterning substrates using asymmetric physical vapor deposition
APPLIED MATERIALS INC0 citations52
US12351909B2Jul 8, 2025
Gap fill methods using catalyzed deposition
APPLIED MATERIALS INC0 citations51
US11562925B2Jan 24, 2023
Method of depositing multilayer stack including copper over features of a device structure
APPLIED MATERIALS INC0 citations51
US10927450B2Feb 23, 2021
Methods and apparatus for patterning substrates using asymmetric physical vapor deposition
APPLIED MATERIALS INC0 citations51
US10636655B2Apr 28, 2020
Methods for asymmetric deposition of metal on high aspect ratio nanostructures
APPLIED MATERIALS INC0 citations51
US10304732B2May 28, 2019
Methods and apparatus for filling substrate features with cobalt
APPLIED MATERIALS INC0 citations51
US10283345B2May 7, 2019
Methods for pre-cleaning conductive materials on a substrate
APPLIED MATERIALS INC0 citations51
US12581926B2Mar 17, 2026
Methods and apparatus for processing a substrate
APPLIED MATERIALS INC0 citations49
US12565702B2Mar 3, 2026
Method of selective metal deposition using separated reactant activation and plasma discharging zone
APPLIED MATERIALS INC0 citations49
US12191198B2Jan 7, 2025
Low resistivity tungsten film and method of manufacture
APPLIED MATERIALS INC0 citations48
US12580152B2Mar 17, 2026
Apparatus and method of damage mitigation and step coverage enhancement
APPLIED MATERIALS INC0 citations46
US10014179B2Jul 3, 2018
Methods for forming cobalt-copper selective fill for an interconnect
APPLIED MATERIALS INC0 citations41