Inventor
Huang ping wei
TW6 patents
⚠️ This page may combine multiple inventors who share the name “Huang ping wei”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED MICROELECTRONICS CORP
5 patentsUS9847247B2Dec 19, 2017
Method for filling gaps of semiconductor device and semiconductor device formed by the same
UNITED MICROELECTRONICS CORP284 citations97
US9793174B1Oct 17, 2017
FinFET device on silicon-on-insulator and method of forming the same
UNITED MICROELECTRONICS CORP22 citations92
US9685319B2Jun 20, 2017
Method for filling gaps of semiconductor device and semiconductor device formed by the same
UNITED MICROELECTRONICS CORP5 citations82
US11862727B2Jan 2, 2024
Method for fabricating fin structure for fin field effect transistor
UNITED MICROELECTRONICS CORP0 citations55
US11581438B2Feb 14, 2023
Fin structure for fin field effect transistor and method for fabrication the same
UNITED MICROELECTRONICS CORP0 citations55