P

Inventor

KAWABATA KENICHI

JP102 patents
⚠️ This page may combine multiple inventors who share the name “KAWABATA KENICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TDK CORP

22 patents
US6908960B2Jun 21, 2005

Composite dielectric material, composite dielectric substrate, prepreg, coated metal foil, molded sheet, composite magnetic substrate, substrate, double side metal foil-clad substrate, flame retardant substrate, polyvinylbenzyl ether resin composition, thermosettin

TDK CORP58 citations94
US8026614B2Sep 27, 2011

Semiconductor IC-embedded substrate and method for manufacturing same

TDK CORP17 citations92
US7868464B2Jan 11, 2011

Multilayer substrate and manufacturing method thereof

TDK CORP40 citations92
US7247590B2Jul 24, 2007

Composite dielectric, composite dielectric sheet, composite dielectric paste, metal-layered composite dielectric, wiring board and multilayer wiring board

TDK CORP30 citations92
US9972579B1May 15, 2018

Composite magnetic sealing material and electronic circuit package using the same

TDK CORP14 citations84
US9881877B2Jan 30, 2018

Electronic circuit package using composite magnetic sealing material

TDK CORP5 citations84
US7733600B2Jun 8, 2010

Hard disk drive and wireless data terminal using the same

TDK CORP10 citations84
US7547975B2Jun 16, 2009

Module with embedded semiconductor IC and method of fabricating the module

TDK CORP14 citations84
US7544537B2Jun 9, 2009

Semiconductor IC-embedded substrate and method for manufacturing same

TDK CORP9 citations84
US9953932B2Apr 24, 2018

Electronic circuit package

TDK CORP7 citations83
US7761982B2Jul 27, 2010

Method for manufacturing IC-embedded substrate

TDK CORP7 citations74
US10448546B1Oct 15, 2019

Noise suppression sheet

TDK CORP2 citations73
US10403582B2Sep 3, 2019

Electronic circuit package using composite magnetic sealing material

TDK CORP5 citations73
US10362686B2Jul 23, 2019

Lead-free solder and electronic component built-in module

TDK CORP2 citations73
US10269727B2Apr 23, 2019

Composite magnetic sealing material and electronic circuit package using the same as mold material

TDK CORP4 citations73
US10256194B2Apr 9, 2019

Electronic circuit package using composite magnetic sealing material

TDK CORP4 citations73
US10242954B2Mar 26, 2019

Electronic circuit package having high composite shielding effect

TDK CORP4 citations73
US9907179B2Feb 27, 2018

Electronic circuit package

TDK CORP4 citations73
US9818518B2Nov 14, 2017

Composite magnetic sealing material

TDK CORP4 citations73
US9439288B2Sep 6, 2016

Mounting structure of chip component and electronic module using the same

TDK CORP3 citations73
US10170431B2Jan 1, 2019

Electronic circuit package

TDK CORP5 citations72
US9966343B2May 8, 2018

Electronic circuit package

TDK CORP4 citations72

HITACHI LTD

10 patents

RICOH CO LTD

6 patents

RICOH KK

3 patents

NAGASE KENJI

2 patents

FUJITSU LTD

1 patent

HITACHI MEDICAL CORP

1 patent

KAWABATA KENICHI

1 patent

TAKESHITA MIYUKI

1 patent

MORINO TETSU

1 patent

KANEMARU YOSHIKAZU

1 patent

ASAMI SHIGERU

1 patent

Showing the top 50 of 102 patents by PatentIndex Score.