Inventor

LIN CHI-YEN

TW39 patents

⚠️ This page may combine multiple inventors who share the name “LIN CHI-YEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIN CHI-YEN

TAIWAN SEMICONDUCTOR MFG CO LTD

Semiconductor device with post passivation structure and fabrication method therefor

Integrated circuit for low power SRAM

V-shaped SiGe recess volume trim for improved device performance and layout dependence

Methods and apparatus for doped SiGe source/drain stressor deposition

V-shaped SiGe recess volume trim for improved device performance and layout dependence

Method for forming semiconductor device structure with metal silicide layer

SiGe SRAM butted contact resistance improvement

Method of making semiconductor structure including buffer layer

Method for forming semiconductor device structure with metal-semiconductor compound layer

Integrated circuit structure for low power SRAM

Semiconductor structure including buffer layer

SRAM structure

Method of designing a layout, method of making a semiconductor structure and semiconductor structure

Method for forming semiconductor device structure with metal silicide layer

Memory device with improved data retention

Memory device with improved data retention

Integrated circuit and fabricating method thereof

Source/drain recess volume trim for improved device performance and layout dependence

Surface profile for semiconductor region

Semiconductor device with post passivation structure

HUANG JIUN-JIE

Metal-oxide-metal capacitor apparatus with a via-hole region

Metal-oxide-metal capacitor structure

Enhanced wafer test line structure

Reducing metal pits through optical proximity correction

Reducing metal pits through optical proximity correction

TAIWAN SEMICONDUCTOR MFG

Methods and apparatus for doped SiGe source/drain stressor deposition

Semiconductor device having v-shaped region

Semiconductor device having V-shaped region

Surface profile for semiconductor region

CHEN CHAO-HSUING

Methods and apparatus for doped SiGe source/drain stressor deposition

SiGe SRAM butted contact resistance improvement

SRAM cells with dummy insertions

DAXIN MATERIALS CORP

Method for temporary bonding workpiece and adhesive

Laser-debondable composition, laminate thereof, and laser-debonding method

Temporary bonding composition, temporary bonding film, composite film, temporary bonding method and semiconductor wafer package

TSAI MING-HAN

2-2′-disubstituted 9,9′-spirobifluorene-base triaryldiamines and their application

JIUN-JIE HUANG

Reliability assessment of capacitor device

DAXIN MAT CORP

Polyimide precursor, resin composition including, and polyimide formed from such precursor, and use of the polyimide

ADVANCED LITHIUM ELECTROCHEMISTRY CO LTD

Preparation method of battery composite material and precursor thereof