Inventor
LEE YONG MENG
US37 patents
⚠️ This page may combine multiple inventors who share the name “LEE YONG MENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CHARTERED SEMICONDUCTOR MFG
15 patentsUS6025267AFeb 15, 2000
Silicon nitride--TEOS oxide, salicide blocking layer for deep sub-micron devices
CHARTERED SEMICONDUCTOR MFG140 citations98
US7445978B2Nov 4, 2008
Method to remove spacer after salicidation to enhance contact etch stop liner stress on MOS
CHARTERED SEMICONDUCTOR MFG22 citations92
US6927104B2Aug 9, 2005
Method of forming double-gated silicon-on-insulator (SOI) transistors with corner rounding
CHARTERED SEMICONDUCTOR MFG32 citations92
US6258648B1Jul 10, 2001
Selective salicide process by reformation of silicon nitride sidewall spacers
CHARTERED SEMICONDUCTOR MFG19 citations92
US6835609B1Dec 28, 2004
Method of forming double-gate semiconductor-on-insulator (SOI) transistors
CHARTERED SEMICONDUCTOR MFG31 citations91
US6372569B1Apr 16, 2002
Selective formation of hydrogen rich PECVD silicon nitride for improved NMOS transistor performance
CHARTERED SEMICONDUCTOR MFG47 citations91
US7309637B2Dec 18, 2007
Method to enhance device performance with selective stress relief
CHARTERED SEMICONDUCTOR MFG14 citations84
US6787404B1Sep 7, 2004
Method of forming double-gated silicon-on-insulator (SOI) transistors with reduced gate to source-drain overlap capacitance
CHARTERED SEMICONDUCTOR MFG15 citations84
US7256084B2Aug 14, 2007
Composite stress spacer
CHARTERED SEMICONDUCTOR MFG12 citations83
US6583011B1Jun 24, 2003
Method for forming damascene dual gate for improved oxide uniformity and control
CHARTERED SEMICONDUCTOR MFG15 citations82
US7659174B2Feb 9, 2010
Method to enhance device performance with selective stress relief
CHARTERED SEMICONDUCTOR MFG6 citations74
US6436754B1Aug 20, 2002
Selective salicide process by reformation of silicon nitride sidewall spacers
CHARTERED SEMICONDUCTOR MFG7 citations74
US7141854B2Nov 28, 2006
Double-gated silicon-on-insulator (SOI) transistors with corner rounding
CHARTERED SEMICONDUCTOR MFG7 citations73
US6107140AAug 22, 2000
Method of patterning gate electrode conductor with ultra-thin gate oxide
CHARTERED SEMICONDUCTOR MFG13 citations72
US7615427B2Nov 10, 2009
Spacer-less low-k dielectric processes
CHARTERED SEMICONDUCTOR MFG3 citations62
GLOBALFOUNDRIES INC
6 patentsUS9524911B1Dec 20, 2016
Method for creating self-aligned SDB for minimum gate-junction pitch and epitaxy formation in a fin-type IC device
GLOBALFOUNDRIES INC18 citations79
US9607989B2Mar 28, 2017
Forming self-aligned NiSi placement with improved performance and yield
GLOBALFOUNDRIES INC2 citations72
US9202697B2Dec 1, 2015
Forming a gate by depositing a thin barrier layer on a titanium nitride cap
GLOBALFOUNDRIES INC2 citations61
US9147572B2Sep 29, 2015
Using sacrificial oxide layer for gate length tuning and resulting device
GLOBALFOUNDRIES INC0 citations51
US9123783B2Sep 1, 2015
Integrated circuits and methods of forming integrated circuits with interlayer dielectric protection
GLOBALFOUNDRIES INC1 citations49
US9209258B2Dec 8, 2015
Depositing an etch stop layer before a dummy cap layer to improve gate performance
GLOBALFOUNDRIES INC0 citations46
IBM
4 patentsUS7977185B2Jul 12, 2011
Method and apparatus for post silicide spacer removal
IBM9 citations84
US7893502B2Feb 22, 2011
Threshold voltage improvement employing fluorine implantation and adjustment oxide layer
IBM12 citations83
US7598572B2Oct 6, 2009
Silicided polysilicon spacer for enhanced contact area
IBM4 citations63
US7393746B2Jul 1, 2008
Post-silicide spacer removal
IBM6 citations62
POET TECH INC
3 patentsUS12366603B1Jul 22, 2025
Structure and method for testing of PIC with an upturned mirror
POET TECH INC0 citations62
US12105141B2Oct 1, 2024
Structure and method for testing of PIC with an upturned mirror
POET TECH INC0 citations62
US11921156B2Mar 5, 2024
Structure and method for testing of PIC with an upturned mirror
POET TECH INC0 citations62
GLOBALFOUNDRIES SG PTE LTD
3 patentsUS8053327B2Nov 8, 2011
Method of manufacture of an integrated circuit system with self-aligned isolation structures
GLOBALFOUNDRIES SG PTE LTD3 citations62
US7999325B2Aug 16, 2011
Method to remove spacer after salicidation to enhance contact etch stop liner stress on MOS
GLOBALFOUNDRIES SG PTE LTD3 citations62
US7932178B2Apr 26, 2011
Integrated circuit having a plurality of MOSFET devices
GLOBALFOUNDRIES SG PTE LTD0 citations41