Inventor
LAI CHIH-YU
TW49 patents
⚠️ This page may combine multiple inventors who share the name “LAI CHIH-YU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
40 patentsUS9704904B2Jul 11, 2017
Deep trench isolation structures and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD22 citations94
US10163949B2Dec 25, 2018
Image device having multi-layered refractive layer on back surface
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US9871095B2Jan 16, 2018
Stacked capacitor with enhanced capacitance and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US9754993B2Sep 5, 2017
Deep trench isolations and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US9659981B2May 23, 2017
Backside illuminated image sensor with negatively charged layer
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84
US9653507B2May 16, 2017
Deep trench isolation shrinkage method for enhanced device performance
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US9281331B2Mar 8, 2016
High dielectric constant structure for the vertical transfer gates of a complementary metal-oxide semiconductor (CMOS) image sensor
TAIWAN SEMICONDUCTOR MFG CO LTD16 citations84
US10325956B2Jun 18, 2019
Deep trench isolation shrinkage method for enhanced device performance
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10163947B2Dec 25, 2018
Photodiode gate dielectric protection layer
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9812477B2Nov 7, 2017
Photodiode gate dielectric protection layer
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9627326B2Apr 18, 2017
Method for forming alignment marks and structure of same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9425343B2Aug 23, 2016
Mechanisms for forming image sensor device
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US12471377B2Nov 11, 2025
Method of forming semiconductor device having segmented interconnect
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12243822B2Mar 4, 2025
Method of manufacturing integrated circuit
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12034009B2Jul 9, 2024
Semiconductor device segmented interconnect
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11862562B2Jan 2, 2024
Integrated circuit conductive line arrangement for circuit structures, and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US10868050B2Dec 15, 2020
Backside illuminated image sensor with negatively charged layer
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US10074612B2Sep 11, 2018
Method for forming alignment marks and structure of same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US12513977B2Dec 30, 2025
Semiconductor cell and active area arrangement
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12408440B2Sep 2, 2025
Method of making amphi-FET structure and method of designing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12346644B2Jul 1, 2025
Arrangement of source or drain conductors of transistor
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12266594B2Apr 1, 2025
Method of making semiconductor device having self-aligned interconnect structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12087801B2Sep 10, 2024
Deep trench isolations and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12080738B2Sep 3, 2024
Image sensor having stacked metal oxide films as fixed charge film
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12057390B2Aug 6, 2024
Source/drain isolation structure, layout, and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12009362B2Jun 11, 2024
Method of making amphi-FET structure and method of designing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11853670B2Dec 26, 2023
Arrangement of source or drain conductors of transistor
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11854940B2Dec 26, 2023
Semiconductor device having self-aligned interconnect structure and method of making
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11764213B2Sep 19, 2023
Amphi-FET structure, method of making and method of designing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11217621B2Jan 4, 2022
Deep trench isolations and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11101307B2Aug 24, 2021
Image sensor having stacked conformal films
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10964746B2Mar 30, 2021
Deep trench isolation shrinkage method for enhanced device performance
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12364006B2Jul 15, 2025
Integrated circuit and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US12218058B2Feb 4, 2025
Integrated circuits having stacked transistors and backside power nodes
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10868058B2Dec 15, 2020
Photodiode gate dielectric protection layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10170539B2Jan 1, 2019
Stacked capacitor with enhanced capacitance
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9412781B2Aug 9, 2016
Photodiode gate dielectric protection layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9147710B2Sep 29, 2015
Photodiode gate dielectric protection layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US12519035B2Jan 6, 2026
Semiconductor device and method of making
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US12417980B2Sep 16, 2025
First metal structure, layout, and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
TAIWAN SEMICONDUCTOR MFG
4 patentsUS8048813B2Nov 1, 2011
Method of reducing delamination in the fabrication of small-pitch devices
TAIWAN SEMICONDUCTOR MFG20 citations93
US9190441B2Nov 17, 2015
Image sensor trench isolation with conformal doping
TAIWAN SEMICONDUCTOR MFG5 citations73
US9355964B2May 31, 2016
Method for forming alignment marks and structure of same
TAIWAN SEMICONDUCTOR MFG2 citations63
US9252296B2Feb 2, 2016
Semiconductor device with compressive layers
TAIWAN SEMICONDUCTOR MFG1 citations52
LAI CHIH-YU
3 patentsUS8853811B2Oct 7, 2014
Image sensor trench isolation with conformal doping
LAI CHIH-YU10 citations83
US8778807B2Jul 15, 2014
Method of reducing delamination in the fabrication of small-pitch devices
LAI CHIH-YU7 citations83
US8802457B2Aug 12, 2014
Backside surface treatment of semiconductor chips
LAI CHIH-YU0 citations51