Inventor
WANG JHIH-YU
TW14 patents
⚠️ This page may combine multiple inventors who share the name “WANG JHIH-YU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
13 patentsUS11114407B2Sep 7, 2021
Integrated fan-out package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US11894336B2Feb 6, 2024
Integrated fan-out package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations74
US11694967B2Jul 4, 2023
Package structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations74
US11276647B2Mar 15, 2022
Method of forming semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10978405B1Apr 13, 2021
Integrated fan-out package
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11798893B2Oct 24, 2023
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11289426B2Mar 29, 2022
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US12412867B2Sep 9, 2025
Integrated fan-out package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12211802B2Jan 28, 2025
Package structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12205903B2Jan 21, 2025
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11854997B2Dec 26, 2023
Method of forming semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10607941B2Mar 31, 2020
Method of forming semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9905471B2Feb 27, 2018
Integrated circuit structure and method forming trenches with different depths
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations39