Inventor

HUANG SHAOWU

US61 patents

⚠️ This page may combine multiple inventors who share the name “HUANG SHAOWU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HUANG SHAOWU

INVENSAS BONDING TECH INC

Cavity packages

Seal for microelectronic assembly

Interface structures and methods for forming same

Structure comprising at least a first element bonded to a carrier having a closed metallic channel waveguide formed therein

Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes

Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects

Interface structures and methods for forming same

Seal for microelectronic assembly

Seal for microelectronic assembly

Selective recess

Interface structures and methods for forming same

INVENSAS CORP

Dielets on flexible and stretchable packaging for microelectronics

Wire bonding method and apparatus for electromagnetic interference shielding

Wire bonding method and apparatus for electromagnetic interference shielding

Surface integrated waveguides and circuit structures therefor

Methods of forming flipped RF filter components

Dielets on flexible and stretchable packaging for microelectronics

Stacked transmission line

Flipped RF filters and components

Wire bonding method and apparatus for electromagnetic interference shielding

ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC

Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects

Bonded structures with integrated passive component

Cavity packages

Seal for microelectronic assembly

Bonded structures with integrated passive component

Seal for microelectronic assembly

Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects

Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes

MARVELL ASIA PTE LTD

Printed circuit boards with meshed conductive structures

Common-mode filtering for converting differential signaling to single-ended signaling

Electrostatic discharge protection apparatus and method for data transceiver

Printed circuit board including on-board integrated enclosure for electromagnetic compatibility shielding

Common-mode filtering for converting differential signaling to single-ended signaling

PCB RF noise grounding for shielded high-speed interface cable

Automotive network communication devices and cabling with electromagnetic shielding

On-board integrated enclosure for electromagnetic compatibility shielding

INTEL CORP

Memory module adaptor card

Printed circuit board having a signal conductor disposed adjacent one or more trenches filled with a low-loss ambient medium

Memory module adaptor card

Reconfigurable repeater system

XCELSIS CORP

Direct-bonded native interconnects and active base die

Direct-bonded native interconnects and active base die

Direct-bonded native interconnects and active base die

ADEIA SEMICONDUCTOR TECH LLC

Wire bonding method and apparatus for electromagnetic interference shielding

Wire bonding method and apparatus for electromagnetic interference shielding

Wire bonding method and apparatus for electromagnetic interference shielding

ADEIA SEMICONDUCTOR INC

Direct-bonded native interconnects and active base die

Direct-bonded native interconnects and active base die

INVENSAS LLC

Stacked transmission line

TSANG LEUNG W

Full wave modeling and simulations of the waveguide behavior of printed circuit boards using a broadband green&#39;s function technique

Full wave modeling and simulations of the waveguide behavior of printed circuit boards using a broadband green's function technique