Inventor
NAKAHARA TAKAYOSHI
JP14 patents
Patents
14 patentsUS12147160B2Nov 19, 2024
Resist underlayer film material, patterning process, and method for forming resist underlayer film
SHINETSU CHEMICAL CO1 citations62
US12032293B2Jul 9, 2024
Composition for forming organic film, patterning process, and polymer
SHINETSU CHEMICAL CO0 citations62
US11675268B2Jun 13, 2023
Composition for forming organic film, patterning process, and polymer
SHINETSU CHEMICAL CO0 citations61
US11680133B2Jun 20, 2023
Material for forming organic film, patterning process, and polymer
SHINETSU CHEMICAL CO0 citations59
US12351742B2Jul 8, 2025
Material for forming adhesive film, patterning process, and method for forming adhesive film
SHINETSU CHEMICAL CO0 citations58
US12498639B2Dec 16, 2025
Material for forming adhesive film, method for forming adhesive film using the same, and patterning process using material for forming adhesive film
SHINETSU CHEMICAL CO0 citations51
US12215221B2Feb 4, 2025
Material for forming organic film, method for forming organic film, patterning process, and compound
SHINETSU CHEMICAL CO0 citations51
US12105420B2Oct 1, 2024
Coating-type composition for forming organic film, patterning process, polymer, and method for manufacturing polymer
SHINETSU CHEMICAL CO0 citations51
US12013640B2Jun 18, 2024
Resist underlayer film material, patterning process, and method for forming resist underlayer film
SHINETSU CHEMICAL CO0 citations51
US11822247B2Nov 21, 2023
Material for forming organic film, method for forming organic film, patterning process, and compound
SHINETSU CHEMICAL CO0 citations51
US11720023B2Aug 8, 2023
Material for forming organic film, method for forming organic film, patterning process, and compound
SHINETSU CHEMICAL CO0 citations51
US10131603B2Nov 20, 2018
Method for reducing metal of sugar-alcohol compound and sugar-alcohol compound
SHINETSU CHEMICAL CO0 citations51
US11709429B2Jul 25, 2023
Composition for forming organic film, patterning process, and polymer
SHINETSU CHEMICAL CO0 citations47
US12535737B2Jan 27, 2026
Material for forming adhesive film, patterning process, and method for forming adhesive film
SHINETSU CHEMICAL CO0 citations46