Inventor
OGINO HARUO
JP5 patents
Patents
5 patentsUS5690837ANov 25, 1997
Process for producing multilayer printed circuit board
HITACHI CHEMICAL CO LTD55 citations95
US4902551AFeb 20, 1990
Process for treating copper surface
HITACHI CHEMICAL CO LTD109 citations94
US5243144ASep 7, 1993
Wiring board and process for producing the same
HITACHI CHEMICAL CO LTD7 citations71
US9966164B2May 8, 2018
Insulated coated wire having a wire coating layer of a resin surrounded by a wire adhesive layer of a resin
HITACHI CHEMICAL CO LTD2 citations70
US10027012B2Jul 17, 2018
Multilayer wiring plate and method for fabricating same
HITACHI CHEMICAL CO LTD0 citations39