P

Inventor

TAKANO KENTARO

JP56 patents
⚠️ This page may combine multiple inventors who share the name “TAKANO KENTARO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MITSUBISHI GAS CHEMICAL CO

17 patents
US10550244B2Feb 4, 2020

Resin composition, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board

MITSUBISHI GAS CHEMICAL CO2 citations71
US11118012B2Sep 14, 2021

Resin composition, prepreg, metal-foil-clad laminate, resin sheet, and printed wiring board

MITSUBISHI GAS CHEMICAL CO0 citations59
US11008420B2May 18, 2021

Resin composition, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board

MITSUBISHI GAS CHEMICAL CO0 citations58
US10550228B2Feb 4, 2020

Resin composition, prepreg, metal foil-clad laminate, and printed circuit board

MITSUBISHI GAS CHEMICAL CO1 citations58
US11939447B2Mar 26, 2024

Thermosetting composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board

MITSUBISHI GAS CHEMICAL CO0 citations57
US12195566B2Jan 14, 2025

Film, laminate, semiconductor wafer with film layer, substrate for mounting semiconductor with film layer, and semiconductor device

MITSUBISHI GAS CHEMICAL CO0 citations56
US9999126B2Jun 12, 2018

Resin composition for printed wiring board, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board

MITSUBISHI GAS CHEMICAL CO0 citations52
US9974169B2May 15, 2018

Resin composition, prepreg, metal-foil-clad laminate, resin composite sheet, and printed wiring board

MITSUBISHI GAS CHEMICAL CO0 citations50
US12534559B2Jan 27, 2026

Resin composition, resin sheet, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device

MITSUBISHI GAS CHEMICAL CO0 citations49
US10703855B2Jul 7, 2020

Resin composition, prepreg, metal-foil-clad laminate, resin sheet, and printed circuit board

MITSUBISHI GAS CHEMICAL CO0 citations49
US10174149B2Jan 8, 2019

Cyanic acid ester compound and method for producing same, resin composition, and cured product

MITSUBISHI GAS CHEMICAL CO0 citations49
US11166370B2Nov 2, 2021

Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board

MITSUBISHI GAS CHEMICAL CO0 citations48
US10689496B2Jun 23, 2020

Resin composition, prepreg, metal foil-clad laminate, resin sheet and printed circuit board

MITSUBISHI GAS CHEMICAL CO0 citations48
US11760871B2Sep 19, 2023

Thermosetting resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed wiring board

MITSUBISHI GAS CHEMICAL CO0 citations47
US11098195B2Aug 24, 2021

Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed circuit board

MITSUBISHI GAS CHEMICAL CO0 citations47
US12568848B2Mar 3, 2026

Film, laminate, semiconductor wafer with film layer, substrate for mounting a semiconductor with film layer, and semiconductor device

MITSUBISHI GAS CHEMICAL CO0 citations45
US9907166B2Feb 27, 2018

Resin composition for printed circuit board, prepreg, resin composite sheet and metal foil clad laminate

MITSUBISHI GAS CHEMICAL CO0 citations42

HITACHI GLOBAL STORAGE TECH

8 patents

FUJI XEROX CO LTD

6 patents

FUJIFILM BUSINESS INNOVATION CORP

5 patents

IBM

3 patents

HGST Netherlands BV

3 patents

BIAN XIAOPING

2 patents

CANON KK

2 patents

HITACHI GLOBAL STORAGE TECH NL

2 patents

FOLKS LIESL

1 patent

TAKANO KENTARO

1 patent

Showing the top 50 of 56 patents by PatentIndex Score.