Inventor
HUDSON GUY F
US43 patents
⚠️ This page may combine multiple inventors who share the name “HUDSON GUY F”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
41 patentsUS6200901B1Mar 13, 2001
Polishing polymer surfaces on non-porous CMP pads
MICRON TECHNOLOGY INC177 citations99
US5972792AOct 26, 1999
Method for chemical-mechanical planarization of a substrate on a fixed-abrasive polishing pad
MICRON TECHNOLOGY INC267 citations99
US5830806ANov 3, 1998
Wafer backing member for mechanical and chemical-mechanical planarization of substrates
MICRON TECHNOLOGY INC157 citations99
US6103636AAug 15, 2000
Method and apparatus for selective removal of material from wafer alignment marks
MICRON TECHNOLOGY INC122 citations98
US6057602AMay 2, 2000
Low friction polish-stop stratum for endpointing chemical-mechanical planarization processing of semiconductor wafers
MICRON TECHNOLOGY INC98 citations98
US5976000ANov 2, 1999
Polishing pad with incompressible, highly soluble particles for chemical-mechanical planarization of semiconductor wafers
MICRON TECHNOLOGY INC144 citations98
US5679169AOct 21, 1997
Method for post chemical-mechanical planarization cleaning of semiconductor wafers
MICRON TECHNOLOGY INC100 citations98
US6368194B1Apr 9, 2002
Apparatus for controlling PH during planarization and cleaning of microelectronic substrates
MICRON TECHNOLOGY INC135 citations97
US6220934B1Apr 24, 2001
Method for controlling pH during planarization and cleaning of microelectronic substrates
MICRON TECHNOLOGY INC100 citations97
US6329301B1Dec 11, 2001
Method and apparatus for selective removal of material from wafer alignment marks
MICRON TECHNOLOGY INC25 citations96
US6273101B1Aug 14, 2001
Method for post chemical-mechanical planarization cleaning of semiconductor wafers
MICRON TECHNOLOGY INC53 citations96
US6114706ASep 5, 2000
Method and apparatus for predicting process characteristics of polyurethane pads
MICRON TECHNOLOGY INC46 citations96
US6048405AApr 11, 2000
Megasonic cleaning methods and apparatus
MICRON TECHNOLOGY INC43 citations96
US6006765ADec 28, 1999
Megasonic cleaning methods and apparatus
MICRON TECHNOLOGY INC47 citations96
US5956612ASep 21, 1999
Trench/hole fill processes for semiconductor fabrication
MICRON TECHNOLOGY INC58 citations96
US5894852AApr 20, 1999
Method for post chemical-mechanical planarization cleaning of semiconductor wafers
MICRON TECHNOLOGY INC85 citations96
US5849091ADec 15, 1998
Megasonic cleaning methods and apparatus
MICRON TECHNOLOGY INC78 citations96
US5798302AAug 25, 1998
Low friction polish-stop stratum for endpointing chemical-mechanical planarization processing of semiconductor wafers
MICRON TECHNOLOGY INC75 citations96
US5650619AJul 22, 1997
Quality control method for detecting defective polishing pads used in chemical-mechanical planarization of semiconductor wafers
MICRON TECHNOLOGY INC71 citations96
US6407000B1Jun 18, 2002
Method and apparatuses for making and using bi-modal abrasive slurries for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies
MICRON TECHNOLOGY INC35 citations93
US6610610B2Aug 26, 2003
Methods for selective removal of material from wafer alignment marks
MICRON TECHNOLOGY INC13 citations92
US6447634B1Sep 10, 2002
Method and apparatus for selective removal of material from wafer alignment marks
MICRON TECHNOLOGY INC23 citations90
US6640816B2Nov 4, 2003
Method for post chemical-mechanical planarization cleaning of semiconductor wafers
MICRON TECHNOLOGY INC14 citations84
US5825028AOct 20, 1998
Quality control method for detecting defective polishing pads used in planarization of semiconductor wafers
MICRON TECHNOLOGY INC16 citations82
US7122475B2Oct 17, 2006
Methods for using bi-modal abrasive slurries for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies
MICRON TECHNOLOGY INC6 citations74
US7045017B2May 16, 2006
Method for post chemical-mechanical planarization cleaning of semiconductor wafers
MICRON TECHNOLOGY INC5 citations74
US6794289B2Sep 21, 2004
Method and apparatuses for making and using bi-modal abrasive slurries for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies
MICRON TECHNOLOGY INC12 citations74
US6593657B1Jul 15, 2003
Contact integration article
MICRON TECHNOLOGY INC7 citations74
US6889698B2May 10, 2005
Apparatus for selective removal of material from wafer alignment marks
MICRON TECHNOLOGY INC3 citations73
US6530113B2Mar 11, 2003
Apparatus for selective removal of material from wafer alignment marks
MICRON TECHNOLOGY INC8 citations73
US7244681B2Jul 17, 2007
Methods for selective removal of material from wafer alignment marks
MICRON TECHNOLOGY INC3 citations72
US7214125B2May 8, 2007
Method for controlling pH during planarization and cleaning of microelectronic substrates
MICRON TECHNOLOGY INC9 citations72
US6913523B2Jul 5, 2005
Method for controlling pH during planarization and cleaning of microelectronic substrates
MICRON TECHNOLOGY INC4 citations72
US6716089B2Apr 6, 2004
Method for controlling pH during planarization and cleaning of microelectronic substrates
MICRON TECHNOLOGY INC5 citations72
US7294570B2Nov 13, 2007
Contact integration method
MICRON TECHNOLOGY INC2 citations63
US6803316B2Oct 12, 2004
Method of planarizing by removing all or part of an oxidizable material layer from a semiconductor substrate
MICRON TECHNOLOGY INC2 citations63
US6713384B1Mar 30, 2004
Contact integration method
MICRON TECHNOLOGY INC2 citations63
US6635574B2Oct 21, 2003
Method of removing material from a semiconductor substrate
MICRON TECHNOLOGY INC2 citations63
US6440319B1Aug 27, 2002
Method and apparatus for predicting process characteristics of polyurethane pads
MICRON TECHNOLOGY INC2 citations63
US8053371B2Nov 8, 2011
Apparatus and methods for selective removal of material from wafer alignment marks
MICRON TECHNOLOGY INC0 citations52
USRE39413ENov 28, 2006
Low friction polish-stop stratum for endpointing chemical-mechanical planarization processing of semiconductor wafers
MICRON TECHNOLOGY INC0 citations47