P

Inventor

BERGSTEDT LEIF

SE27 patents
⚠️ This page may combine multiple inventors who share the name “BERGSTEDT LEIF”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ERICSSON TELEFON AB L M

22 patents
US6690583B1Feb 10, 2004

Carrier for electronic components

ERICSSON TELEFON AB L M120 citations98
US6266016B1Jul 24, 2001

Microstrip arrangement

ERICSSON TELEFON AB L M226 citations95
US6421225B2Jul 16, 2002

Electric component

ERICSSON TELEFON AB L M38 citations92
US6249962B1Jun 26, 2001

Process for manufacturing a multi-layer circuit board with supporting layers of different materials

ERICSSON TELEFON AB L M18 citations92
US5977915ANov 2, 1999

Microstrip structure

ERICSSON TELEFON AB L M32 citations92
US6459585B1Oct 1, 2002

Method of producing printed circuit boards and a heat sink arrangement produced in accordance with the method

ERICSSON TELEFON AB L M17 citations84
US6424318B1Jul 23, 2002

Method and arrangement pertaining to microwave lenses

ERICSSON TELEFON AB L M15 citations80
US6011692AJan 4, 2000

Chip supporting element

ERICSSON TELEFON AB L M16 citations77
US6724283B2Apr 20, 2004

Arrangement mounted on a printed circuit board and method of producing such an arrangement

ERICSSON TELEFON AB L M11 citations74
US6395378B2May 28, 2002

PCB and method for making PCB with thin copper layer

ERICSSON TELEFON AB L M11 citations74
US7102480B2Sep 5, 2006

Printed circuit board integrated switch

ERICSSON TELEFON AB L M8 citations73
US6552265B1Apr 22, 2003

Printed board assembly and method of its manufacture

ERICSSON TELEFON AB L M12 citations71
US6150982ANov 21, 2000

Antenna arrangement

ERICSSON TELEFON AB L M10 citations70
US6038122AMar 14, 2000

Decoupling capacitor

ERICSSON TELEFON AB L M13 citations66
US6617509B1Sep 9, 2003

Arrangement relating to conductor carriers and methods for the manufacture of such carriers

ERICSSON TELEFON AB L M6 citations63
US6230401B1May 15, 2001

Method and an arrangement in an electronics system

ERICSSON TELEFON AB L M6 citations63
US7051430B2May 30, 2006

Method of manufacturing a printed board assembly

ERICSSON TELEFON AB L M3 citations60
US6459347B1Oct 1, 2002

Method for vertical connection of conductors in a device in the microwave range

ERICSSON TELEFON AB L M2 citations59
US7192882B2Mar 20, 2007

Component for electromagnetic waves and a method for manufacturing the same

ERICSSON TELEFON AB L M4 citations57
US6433423B2Aug 13, 2002

Method and an arrangement relating to chip carriers

ERICSSON TELEFON AB L M5 citations54
US6717063B2Apr 6, 2004

Multi-layer circuit board with supporting layers of different materials

ERICSSON TELEFON AB L M0 citations52
US6369677B1Apr 9, 2002

Arrangement for more even current distribution in a transmission line

ERICSSON TELEFON AB L M1 citations52

HUAWEI TECH CO LTD

3 patents

IMEGO AB

1 patent

BERGSTEDT LEIF

1 patent