Inventor
SHIM DONG-SIK
KR37 patents
⚠️ This page may combine multiple inventors who share the name “SHIM DONG-SIK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
30 patentsUS7148141B2Dec 12, 2006
Method for manufacturing metal structure having different heights
SAMSUNG ELECTRONICS CO LTD37 citations92
US9319800B2Apr 19, 2016
Electro acoustic transducer
SAMSUNG ELECTRONICS CO LTD9 citations84
US8349199B2Jan 8, 2013
Ink feedhole of inkjet printhead and method of forming the same
SAMSUNG ELECTRONICS CO LTD8 citations84
US7893442B2Feb 22, 2011
Schottky diode having low breakdown voltage and method for fabricating the same
SAMSUNG ELECTRONICS CO LTD9 citations84
US7208947B2Apr 24, 2007
Fluxgate sensor integrated in a semiconductor substrate and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD10 citations84
US7041526B2May 9, 2006
Magnetic field detecting element and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD12 citations84
US7482930B2Jan 27, 2009
Limiter for controlling overvoltage and RFID tag having the same
SAMSUNG ELECTRONICS CO LTD17 citations83
US9596528B2Mar 14, 2017
Capacitive micromachined ultrasonic transducer and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD2 citations73
US7382123B2Jun 3, 2008
Micro fluxgate sensor and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD8 citations73
US7810911B2Oct 12, 2010
Thermal inkjet printhead
SAMSUNG ELECTRONICS CO LTD4 citations63
US7703891B2Apr 27, 2010
Heater to control bubble and inkjet printhead having the heater
SAMSUNG ELECTRONICS CO LTD2 citations63
US7506442B2Mar 24, 2009
Method of fabricating inkjet printhead
SAMSUNG ELECTRONICS CO LTD4 citations63
US7416675B2Aug 26, 2008
Method of fabricating inkjet print heads
SAMSUNG ELECTRONICS CO LTD2 citations63
US7309924B2Dec 18, 2007
UBM for fine pitch solder ball and flip-chip packaging method using the same
SAMSUNG ELECTRONICS CO LTD6 citations63
US7189638B2Mar 13, 2007
Method for manufacturing metal structure using trench
SAMSUNG ELECTRONICS CO LTD3 citations62
US7145332B2Dec 5, 2006
Magnetic field sensing device and method for fabricating thereof
SAMSUNG ELECTRONICS CO LTD2 citations62
US6627821B2Sep 30, 2003
Circuit board and method of manufacturing therefor
SAMSUNG ELECTRONICS CO LTD4 citations62
US11733583B2Aug 22, 2023
Optical beam steering devices and sensor systems including the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11378662B2Jul 5, 2022
Optical integrated circuit device array having bi-directional characteristics and optical system using the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11099455B2Aug 24, 2021
Optical beam steering devices and sensor systems including the same
SAMSUNG ELECTRONICS CO LTD1 citations61
US10093534B2Oct 9, 2018
Capacitive micromachined ultrasonic transducer and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US9957155B2May 1, 2018
Capacitive micromachined ultrasonic transducer and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US9664894B2May 30, 2017
Micro optical switch device, image display apparatus including the same, and method of manufacturing the micro optical switch device
SAMSUNG ELECTRONICS CO LTD0 citations52
US9475092B2Oct 25, 2016
Electro-acoustic transducer and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US7959265B2Jun 14, 2011
Thermal inkjet printhead
SAMSUNG ELECTRONICS CO LTD0 citations52
US7758168B2Jul 20, 2010
Inkjet printhead and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US7382035B2Jun 3, 2008
Schottky diode with low leakage current and fabrication method thereof
SAMSUNG ELECTRONICS CO LTD1 citations52
US7071688B2Jul 4, 2006
Magnetic field sensing device and method for fabricating thereof
SAMSUNG ELECTRONICS CO LTD0 citations52
US9164276B2Oct 20, 2015
Micro optical switching device, image display apparatus including micro optical switching device, and method of manufacturing micro optical switching device
SAMSUNG ELECTRONICS CO LTD0 citations42
US9110318B2Aug 18, 2015
Driving device of display apparatus and method of manufacturing the driving device
SAMSUNG ELECTRONICS CO LTD0 citations42
SHIM DONG-SIK
2 patentsUS8109609B2Feb 7, 2012
Ink ejecting device and method of manufacturing the same
SHIM DONG-SIK10 citations81
US9164278B2Oct 20, 2015
Micro-optical switching device, image display apparatus including micro-optical switching device, and method of manufacturing micro-optical switching device
SHIM DONG-SIK1 citations50
LEE MOON-CHUL
2 patentsUS8114578B2Feb 14, 2012
Method of manufacturing photosensitive epoxy structure using photolithography process and method of manufacturing inkjet printhead using the method of manufacturing photosensitive epoxy structure
LEE MOON-CHUL0 citations51
US8066356B2Nov 29, 2011
Thermal inkjet print head
LEE MOON-CHUL0 citations41