Inventor
LEE KUANG-SHIN
TW7 patents
Patents
7 patentsUS7060592B2Jun 13, 2006
Image sensor and fabricating method thereof
UNITED MICROELECTRONICS CORP18 citations82
US7009287B2Mar 7, 2006
Chip on photosensitive device package structure and electrical connection thereof
UNITED MICROELECTRONICS CORP16 citations82
US6930398B1Aug 16, 2005
Package structure for optical image sensing integrated circuits
UNITED MICROELECTRONICS CORP18 citations82
US7291908B2Nov 6, 2007
Quad flat no-lead package structure and manufacturing method thereof
UNITED MICROELECTRONICS CORP9 citations72
US7531381B2May 12, 2009
Manufacturing method of a quad flat no-lead package structure
UNITED MICROELECTRONICS CORP2 citations61
US6921681B2Jul 26, 2005
Process for manufacturing photosensitive module
UNITED MICROELECTRONICS CORP4 citations61
US7663693B2Feb 16, 2010
Camera module
UNITED MICROELECTRONICS CORP3 citations60