Inventor
LEE JONG-YUN
KR17 patents
⚠️ This page may combine multiple inventors who share the name “LEE JONG-YUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
9 patentsUS7663250B2Feb 16, 2010
Wafer level package and manufacturing method thereof
SAMSUNG ELECTRO MECH26 citations92
US9899141B2Feb 20, 2018
Common mode filter and method of manufacturing the same
SAMSUNG ELECTRO MECH4 citations73
US9520223B2Dec 13, 2016
Inductor and method for manufacturing the same
SAMSUNG ELECTRO MECH3 citations73
US7632709B2Dec 15, 2009
Method of manufacturing wafer level package
SAMSUNG ELECTRO MECH7 citations73
US9986640B2May 29, 2018
Coil component and method of manufacturing the same
SAMSUNG ELECTRO MECH2 citations72
US9240274B2Jan 19, 2016
Common mode filter and method of manufacturing the same
SAMSUNG ELECTRO MECH0 citations52
US9009950B2Apr 21, 2015
Method for manufacturing high frequency inductor
SAMSUNG ELECTRO MECH0 citations52
US9230727B2Jan 5, 2016
Thin film type common mode filter
SAMSUNG ELECTRO MECH1 citations51
US9153957B2Oct 6, 2015
Electrostatic discharge protection device and method for manufacturing the same
SAMSUNG ELECTRO MECH1 citations51
PARK SEUNG WOOK
3 patentsUS8143099B2Mar 27, 2012
Method of manufacturing semiconductor package by etching a metal layer to form a rearrangement wiring layer
PARK SEUNG WOOK8 citations83
US8704350B2Apr 22, 2014
Stacked wafer level package and method of manufacturing the same
PARK SEUNG WOOK11 citations82
US8658467B2Feb 25, 2014
Method of manufacturing stacked wafer level package
PARK SEUNG WOOK7 citations81