Inventor
SUK KYOUNGLIM
KR10 patents
Patents
10 patentsUS12581978B2Mar 17, 2026
Semiconductor package including under bump metallization pad
SAMSUNG ELECTRONICS CO LTD0 citations60
US12040264B2Jul 16, 2024
Semiconductor package including under bump metallization pad
SAMSUNG ELECTRONICS CO LTD0 citations60
US12009274B2Jun 11, 2024
Semiconductor package including thermal exhaust pathway
SAMSUNG ELECTRONICS CO LTD0 citations59
US12068302B2Aug 20, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations56
US11670629B2Jun 6, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations56
US12237250B2Feb 25, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations51
US12519079B2Jan 6, 2026
Method of manufacturing semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations50
US12388040B2Aug 12, 2025
Semiconductor package including redistribution substrate and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations50
US11955499B2Apr 9, 2024
Image sensor package including glass substrate and a plurality of redistribution layers disposed below the glass substrate and spaced apart from each other by a predetermined distance
SAMSUNG ELECTRONICS CO LTD0 citations50
US12519048B2Jan 6, 2026
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations48