Inventor

ZHENG TIEYU

US22 patents

⚠️ This page may combine multiple inventors who share the name “ZHENG TIEYU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ZHENG TIEYU

INTEL CORP

Socket assembly for securing socket body

Package for housing an optoelectronic assembly

Method and apparatus for manufacturing a transistor-outline (TO) can having a ceramic header

Land grid array (LGA) socket with cells and method of fabrication and assembly

Socket assembly that includes improved contact arrangement

Method and apparatus for manufacturing a transistor-outline (TO) can having a ceramic header

Extended package substrate

Lateral force countering load mechanism for LGA sockets

Self-balanced land grid array socket

Package for housing an optoelectronic assembly

Pick-and-place cap for socket assembly

Self-balanced dual L-shaped socket

Low-profile package for housing an optoelectronic assembly

Stacked land grid array package

Method and apparatus for manufacturing a transistor-outline (TO) can having a ceramic header

Stacked land grid array package

Socket for land grid array package

Integrated circuit package with spatially varied solder resist opening dimension

Extended package substrate

ZHENG TIEYU

Integrated circuit package with spatially varied solder resist opening dimension

Method of making a self-balanced dual L-shaped socket

TROBOUGH MARK B

Test, validation, and debug architecture