Inventor
HO CHENG-EN
TW12 patents
⚠️ This page may combine multiple inventors who share the name “HO CHENG-EN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNIV YUAN ZE
6 patentsUS11439007B2Sep 6, 2022
Nanotwinned structure
UNIV YUAN ZE0 citations56
US12283488B2Apr 22, 2025
Interconnect structure for insertion loss reduction in signal transmission and method thereof
UNIV YUAN ZE0 citations54
US11430693B1Aug 30, 2022
Method for microstructure modification of conducting lines
UNIV YUAN ZE0 citations54
US9194822B2Nov 24, 2015
Adjustable fixture structure for 3-dimensional X-ray computed tomography
UNIV YUAN ZE2 citations54
US7950565B2May 31, 2011
High speed ball shear machine
UNIV YUAN ZE0 citations41
US9079272B2Jul 14, 2015
Solder joint with a multilayer intermetallic compound structure
UNIV YUAN ZE0 citations35
HO CHENG-EN
3 patentsUS8092621B2Jan 10, 2012
Method for inhibiting growth of nickel-copper-tin intermetallic layer in solder joints
HO CHENG-EN5 citations58
US8702878B2Apr 22, 2014
Method for controlling beta-tin orientation in solder joints
HO CHENG-EN0 citations40
US8207469B2Jun 26, 2012
Method for inhibiting electromigration-induced phase segregation in solder joints
HO CHENG-EN0 citations33