Inventor
WU MING-YUAN
TW40 patents
⚠️ This page may combine multiple inventors who share the name “WU MING-YUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
WU MING-YUAN
12 patentsUS9228724B2Jan 5, 2016
Modular LED lamp structure with replaceable modules
WU MING-YUAN15 citations84
US9183199B2Nov 10, 2015
Communication device for multiple language translation system
WU MING-YUAN8 citations84
US9063931B2Jun 23, 2015
Multiple language translation system
WU MING-YUAN7 citations84
US8461961B2Jun 11, 2013
Tamper-proof secure card with stored biometric data and method for using the secure card
WU MING-YUAN8 citations84
US8685057B2Apr 1, 2014
Disposable dental tweezers
WU MING-YUAN2 citations62
US8050992B2Nov 1, 2011
Secure card with stored biometric data and method for using the secure card
WU MING-YUAN4 citations62
US9228722B2Jan 5, 2016
Outdoor LED lighting device structure with easy installation features
WU MING-YUAN0 citations52
US9157627B2Oct 13, 2015
Modular LED lamp structure with replaceable modules and rapid maintenance
WU MING-YUAN0 citations52
US8461654B2Jun 11, 2013
Spacer shape engineering for void-free gap-filling process
WU MING-YUAN0 citations52
US8353514B2Jan 15, 2013
Spherical puzzle
WU MING-YUAN1 citations52
US7641839B2Jan 5, 2010
Method for fabricating a three dimensional emblem
WU MING-YUAN0 citations52
US8552522B2Oct 8, 2013
Dishing-free gap-filling with multiple CMPs
WU MING-YUAN0 citations50
TAIWAN SEMICONDUCTOR MFG CO LTD
10 patentsUS10707331B2Jul 7, 2020
FinFET device with a reduced width
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations82
US9508718B2Nov 29, 2016
FinFET contact structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US11316030B2Apr 26, 2022
Fin field-effect transistor device and method
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US12131911B2Oct 29, 2024
CMP process and methods thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11616133B2Mar 28, 2023
Fin field-effect transistor device and method
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations61
US12406848B2Sep 2, 2025
Method of fabricating a gate cut feature for multi-gate semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US11387109B1Jul 12, 2022
CMP process and methods thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US9455344B2Sep 27, 2016
Integrated circuit metal gate structure having tapered profile
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations52
US9917088B2Mar 13, 2018
FinFET contact structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US12317578B2May 27, 2025
Semiconductor devices with low leakage current and methods of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations47
TAIWAN SEMICONDUCTOR MFG
7 patentsUS8035165B2Oct 11, 2011
Integrating a first contact structure in a gate last process
TAIWAN SEMICONDUCTOR MFG25 citations93
US8039381B2Oct 18, 2011
Photoresist etch back method for gate last process
TAIWAN SEMICONDUCTOR MFG33 citations92
US7955964B2Jun 7, 2011
Dishing-free gap-filling with multiple CMPs
TAIWAN SEMICONDUCTOR MFG21 citations91
US8048752B2Nov 1, 2011
Spacer shape engineering for void-free gap-filling process
TAIWAN SEMICONDUCTOR MFG9 citations84
US8932951B2Jan 13, 2015
Dishing-free gap-filling with multiple CMPs
TAIWAN SEMICONDUCTOR MFG4 citations73
US9263396B2Feb 16, 2016
Photo alignment mark for a gate last process
TAIWAN SEMICONDUCTOR MFG2 citations63
US8669153B2Mar 11, 2014
Integrating a first contact structure in a gate last process
TAIWAN SEMICONDUCTOR MFG0 citations52