Inventor
ENDOH KEIICHI
JP14 patents
⚠️ This page may combine multiple inventors who share the name “ENDOH KEIICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DOWA ELECTRONICS MATERIALS CO LTD
9 patentsUS10328534B2Jun 25, 2019
Bonding material and bonding method using same
DOWA ELECTRONICS MATERIALS CO LTD2 citations68
US11453053B2Sep 27, 2022
Joining material and joining method using same
DOWA ELECTRONICS MATERIALS CO LTD0 citations60
US10903185B2Jan 26, 2021
Bonding material and bonding method using same
DOWA ELECTRONICS MATERIALS CO LTD0 citations55
US10543569B2Jan 28, 2020
Bonding material and bonding method using same
DOWA ELECTRONICS MATERIALS CO LTD0 citations50
US10821558B2Nov 3, 2020
Bonding material and bonding method using same
DOWA ELECTRONICS MATERIALS CO LTD0 citations48
US10090275B2Oct 2, 2018
Bonding method using bonding material
DOWA ELECTRONICS MATERIALS CO LTD0 citations48
US10008471B2Jun 26, 2018
Bonding material and bonding method using the same
DOWA ELECTRONICS MATERIALS CO LTD0 citations48
US9662748B2May 30, 2017
Metal nanoparticle dispersion, method for producing metal nanoparticle dispersion, and bonding method
DOWA ELECTRONICS MATERIALS CO LTD1 citations48
US12048964B2Jul 30, 2024
Bonding material and bonding method using same
DOWA ELECTRONICS MATERIALS CO LTD0 citations46
ENDOH KEIICHI
4 patentsUS8641929B2Feb 4, 2014
Low-temperature-sinterable bonding material, and bonding method using the bonding material
ENDOH KEIICHI9 citations79
US9533380B2Jan 3, 2017
Bonding material and bonding method in which said bonding material is used
ENDOH KEIICHI2 citations67
US9240256B2Jan 19, 2016
Bonding material and bonding method using the same
ENDOH KEIICHI1 citations58
US8858700B2Oct 14, 2014
Bonding material using metal nanoparticles coated with C6-C8 fatty acids, and bonding method
ENDOH KEIICHI1 citations48